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CMP特性に及ぼすパッド溝断面の傾斜角の影響
https://doi.org/10.24561/00016682
https://doi.org/10.24561/000166827c4c7015-2e3b-4ee8-9079-4adb431daa1a
名前 / ファイル | ライセンス | アクション |
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KY-AA11808968-04-01.pdf (325.1 kB)
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Item type | 紀要論文 / Departmental Bulletin Paper(1) | |||||
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公開日 | 2009-05-14 | |||||
タイトル | ||||||
タイトル | CMP特性に及ぼすパッド溝断面の傾斜角の影響 | |||||
言語 | ||||||
言語 | jpn | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | CMP(Chemical Mechanical polishing) | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | slanted grooves | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | pads | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | removal rate | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | uniformity | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | slurry | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
資源タイプ | departmental bulletin paper | |||||
ID登録 | ||||||
ID登録 | 10.24561/00016682 | |||||
ID登録タイプ | JaLC | |||||
タイトル(別言語) | ||||||
その他のタイトル | Effects of Slanted Cross-Sectional Shapes of Pad Grooves on CMP Characteristics | |||||
著者 |
堀口, 文江
× 堀口, 文江× 土肥, 俊郎× 堀本, 卓× 鈴木, 辰俊× 瀬山, 貴司× 船越, 考雄 |
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著者 ローマ字 | ||||||
HORIGUCHI, Fumie | ||||||
著者 ローマ字 | ||||||
DOI, Toshiro | ||||||
著者 ローマ字 | ||||||
HORIMOTO, Suguru | ||||||
著者 ローマ字 | ||||||
SUZUKI, Tatsutoshi | ||||||
著者 ローマ字 | ||||||
SEYAMA, Takahshi | ||||||
著者 ローマ字 | ||||||
FUNAKOSHI, Takao | ||||||
著者 所属 | ||||||
埼玉大学教育学部 | ||||||
著者 所属 | ||||||
埼玉大学教育学部 | ||||||
著者 所属 | ||||||
埼玉大学教育学部 ; (株)D-Process | ||||||
著者 所属 | ||||||
東邦エンジニアリング株式会社 | ||||||
著者 所属 | ||||||
埼玉大学教育学部 | ||||||
著者 所属 | ||||||
埼玉大学教育学部 | ||||||
著者 所属(別言語) | ||||||
Saitama University | ||||||
著者 所属(別言語) | ||||||
Saitama University | ||||||
著者 所属(別言語) | ||||||
Saitama University ; D-Process lnc. | ||||||
著者 所属(別言語) | ||||||
Toho Engineering Co., Ltd | ||||||
著者 所属(別言語) | ||||||
Saitama University | ||||||
著者 所属(別言語) | ||||||
Saitama University | ||||||
書誌情報 |
埼玉大学地域共同研究センター紀要 en : Report of Cooperative Research Center, Saitama Univerity 巻 4, p. 1-4, 発行日 2004 |
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年月次 | ||||||
2003 | ||||||
出版者名 | ||||||
出版者 | 埼玉大学地域共同研究センター | |||||
ISSN | ||||||
収録物識別子タイプ | ISSN | |||||
収録物識別子 | 13474758 | |||||
概要 | ||||||
内容記述タイプ | Other | |||||
内容記述 | In CMP (Chemical Mechanical Polishing) characteristics, the shapes of grooves formed on pad surface affect greatly on removal rate, non-uniformity within wafer surface and slurry flow rate. They allow the slurry flow toward the center or outside of the pad when the pad is rotating. In this study, how 7 different slanted grooves on the pad surface affect the removal rate and slurry flow rate were examined. As a result, different and unique characteristics were observed. These slanted groove pads may make it possible to improve polishing performances such as removal rate and reducing the amount of slurry to be used. | |||||
資源タイプ | ||||||
内容記述タイプ | Other | |||||
内容記述 | text | |||||
フォーマット | ||||||
内容記述タイプ | Other | |||||
内容記述 | application/pdf | |||||
作成日 | ||||||
日付 | 2009-06-17 | |||||
日付タイプ | Created | |||||
アイテムID | ||||||
KY-AA11808968-04-01 |