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セリアスラリーによる酸化膜の平坦化CMPに関する基礎的検討
https://doi.org/10.24561/00016685
https://doi.org/10.24561/00016685998fe753-b8e5-4bda-b5e4-8dd366885f82
名前 / ファイル | ライセンス | アクション |
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KY-AA11808968-04-04.pdf (221.6 kB)
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Item type | 紀要論文 / Departmental Bulletin Paper(1) | |||||
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公開日 | 2009-05-14 | |||||
タイトル | ||||||
タイトル | セリアスラリーによる酸化膜の平坦化CMPに関する基礎的検討 | |||||
言語 | ||||||
言語 | jpn | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | CMP | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | ceria slurry | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | removal rate | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | isoelectric point | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | zeta potential | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | particle size | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | anion surfactant | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | stability | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
資源タイプ | departmental bulletin paper | |||||
ID登録 | ||||||
ID登録 | 10.24561/00016685 | |||||
ID登録タイプ | JaLC | |||||
タイトル(別言語) | ||||||
その他のタイトル | Basic Study Of Oxide Film Planarization -CMP With Ceria Slurry | |||||
著者 |
ベルナール, ・パコ
× ベルナール, ・パコ× 土肥, 俊郎× 植木, 由佳子× エマニエル, ・ロアート |
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著者 ローマ字 | ||||||
Bernard Pacaud | ||||||
著者 ローマ字 | ||||||
Toshiro. K. Doi | ||||||
著者 ローマ字 | ||||||
Yukako Ueki | ||||||
著者 ローマ字 | ||||||
Emmanuelle.Rohart | ||||||
著者 所属 | ||||||
ローディア エレクトロニクス カタリシス | ||||||
著者 所属 | ||||||
埼玉大学教育学部 | ||||||
著者 所属 | ||||||
埼玉大学教育学部 | ||||||
著者 所属 | ||||||
ローディア エレクトロニクス カタリシス | ||||||
著者 所属(別言語) | ||||||
Rhodia Electronics & Catalysis in France in France | ||||||
著者 所属(別言語) | ||||||
Faculty of Education, Saitama University | ||||||
著者 所属(別言語) | ||||||
Faculty of Education, Saitama University | ||||||
著者 所属(別言語) | ||||||
Rhodia Electronics & Catalysis in France in France | ||||||
書誌情報 |
埼玉大学地域共同研究センター紀要 en : Report of Cooperative Research Center, Saitama Univerity 巻 4, p. 14-17, 発行日 2004 |
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年月次 | ||||||
2003 | ||||||
出版者名 | ||||||
出版者 | 埼玉大学地域共同研究センター | |||||
ISSN | ||||||
収録物識別子タイプ | ISSN | |||||
収録物識別子 | 13474758 | |||||
概要 | ||||||
内容記述タイプ | Other | |||||
内容記述 | In this study, ceria slurries (CeOz) for oxide fIlms are applied for planarization CMP for high performance and high-grade polishing. The investigation on ceria slurry focused on calcination temperature was carried out. Polishing characteristics of oxide mms to disperse ceria particles, which is necessary to make ceria slurry work efficiently, were found. The results indicate that the dispersibility and the removal rate of ceria slurry are affected by pH and the additive rate, and in particular, the removal rate is on the decrease especially by adding the additives. | |||||
資源タイプ | ||||||
内容記述タイプ | Other | |||||
内容記述 | text | |||||
フォーマット | ||||||
内容記述タイプ | Other | |||||
内容記述 | application/pdf | |||||
作成日 | ||||||
日付 | 2009-06-18 | |||||
日付タイプ | Created | |||||
アイテムID | ||||||
KY-AA11808968-04-04 |