WEKO3
アイテム
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平坦化CMPにおけるパッドドレッシングに関する基礎的研究
https://doi.org/10.24561/00016687
https://doi.org/10.24561/00016687ace43466-e1aa-4307-bcf4-6f7b45c9596d
名前 / ファイル | ライセンス | アクション |
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KY-AA11808968-04-06.pdf (469.1 kB)
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Item type | 紀要論文 / Departmental Bulletin Paper(1) | |||||
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公開日 | 2009-05-14 | |||||
タイトル | ||||||
タイトル | 平坦化CMPにおけるパッドドレッシングに関する基礎的研究 | |||||
言語 | ||||||
言語 | jpn | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | pad conditioning | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | CMP | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | pad surface roughness | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | frictional force | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | stick-slip | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
資源タイプ | departmental bulletin paper | |||||
ID登録 | ||||||
ID登録 | 10.24561/00016687 | |||||
ID登録タイプ | JaLC | |||||
タイトル(別言語) | ||||||
その他のタイトル | Study on fundamental pad conditioning mechanism for Chemical Mechanical Polishing | |||||
著者 |
藤田, 隆
× 藤田, 隆× 土肥, 俊郎 |
|||||
著者 ローマ字 | ||||||
Fujita, Takashi | ||||||
著者 ローマ字 | ||||||
Doi, Tashiro | ||||||
著者 所属 | ||||||
株式会社東京精密 | ||||||
著者 所属 | ||||||
埼玉大学教育学部 | ||||||
著者 所属(別言語) | ||||||
Tokyo Seimitsu Co.Ltd | ||||||
著者 所属(別言語) | ||||||
Faculty of Education, Saitama University | ||||||
書誌情報 |
埼玉大学地域共同研究センター紀要 en : Report of Cooperative Research Center, Saitama Univerity 巻 4, p. 22-28, 発行日 2004 |
|||||
年月次 | ||||||
2003 | ||||||
出版者名 | ||||||
出版者 | 埼玉大学地域共同研究センター | |||||
ISSN | ||||||
収録物識別子タイプ | ISSN | |||||
収録物識別子 | 13474758 | |||||
概要 | ||||||
内容記述タイプ | Other | |||||
内容記述 | Fundamental investigation for pad conditioning was studied on CMP (Chemical Mechanical Polishing). In particular, pad surface roughness was focused on various pad surface conditions. Pad conditioning under wet condition makes pad surface roughness finer than pad conditioning under dry condition. The pad surface with fine roughness contributes to rapid pad break-in and removal rate stabilization. In this study, various factors of pad conditioning were verified to clarify the difference of pad conditioning between under wet condition and dry condition. One of major differences of pad conditioning under dry condition against wet condition was the magnitude of friction force between pad and conditioner, which generates stick-slip motion of pad conditioner on a pad. The other was removal efficiency of pad fragment to be scraped away on conditioning pad. Pad fragments disturbs a stable contact between pad and conditioner. Consequently, it will be possible to realize pad pre-conditioning without pasting pad on a platen by taking appropriate measures against the two. | |||||
資源タイプ | ||||||
内容記述タイプ | Other | |||||
内容記述 | text | |||||
フォーマット | ||||||
内容記述タイプ | Other | |||||
内容記述 | application/pdf | |||||
作成日 | ||||||
日付 | 2009-06-18 | |||||
日付タイプ | Created | |||||
アイテムID | ||||||
KY-AA11808968-04-06 |