SUCRA(さくら: Saitama University Cyber Repository of Academic Resources)は、埼玉大学に在籍する研究者の学術雑誌論文、紀要論文、科学研究費補助金成果報告書、学位論文、研究発表プレゼン資料などを登録し、広く世界に発信しています。 埼玉大学に在籍する皆様は、著作物をSUCRAを通じて発信することができます。詳しくは「成果物の登録方法」をご覧ください。
Nomura Micro Science Co.,Ltd
Nomura Micro Science Co.,Ltd
Faculty of Education, Saitama University
Faculty of Education, Saitama University
Nomura Micro Science Co.,Ltd
雑誌名
埼玉大学地域共同研究センター紀要
巻
7
ページ
7 - 10
発行年
2007
年月次
2006
出版者名
埼玉大学総合研究機構地域共同研究センター産学連携推進部門
ISSN
13474758
抄録
Chemical Mechanical Polishing (CMP) is essential for the manufacturing of recent high-performance electronic device. However, for the CMP process, huge amount of slurry is used, which is to be disposed after being used only once. From the viewpoint of reduction of environmental burdens, this study was made for exploring the possibility of recycling of slurry by focusing on the slurry used for Tungsten CMP. For that purpose, we collected the slurry used for polishing and then tried to reuse it for polishing again. As a method for evaluation, we made comparisons of removal rates between new slurry and recovered slurry. The results shows that when collecting the slurry during CMP, it contained the water remained on the surface of the polishing pad after conditioning, by which slurry was diluted and caused the reduction of removal rate of Tungsten film. However, it was found that when making polishing of Tungsten film using the slurry recovered without being diluted with water, the same level of removal rate as new slurry is obtained.
タングステンCMPにおけるスラリーの再生に関する基礎的研究
KY-AA11808968-07-03.pdf
(766.26KB)
SUCRAの概要
