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高圧マイクロジェットを用いたCMPパッドコンディショニング技術
https://doi.org/10.24561/00016782
https://doi.org/10.24561/00016782154cadd4-23b5-4992-a04b-d30bed4620bb
名前 / ファイル | ライセンス | アクション |
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KY-AA11808968-07-05.pdf (722.0 kB)
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Item type | 紀要論文 / Departmental Bulletin Paper(1) | |||||
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公開日 | 2009-03-03 | |||||
タイトル | ||||||
タイトル | 高圧マイクロジェットを用いたCMPパッドコンディショニング技術 | |||||
言語 | ||||||
言語 | jpn | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Chemical Mechanical Polishing (CMP) | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | High pressure Micro Jet (HPMJ) | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Pad Conditioning | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
資源タイプ | departmental bulletin paper | |||||
ID登録 | ||||||
ID登録 | 10.24561/00016782 | |||||
ID登録タイプ | JaLC | |||||
タイトル(別言語) | ||||||
その他のタイトル | CMP Pad Conditioning Technique using a High Pressure Micro Jet | |||||
著者 |
宮地, 計二
× 宮地, 計二× 清家, 善之× 土肥, 俊郎 |
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著者 ローマ字 | ||||||
Miyachi, Keiji | ||||||
著者 ローマ字 | ||||||
Seike, Yoshiyuki | ||||||
著者 ローマ字 | ||||||
Doi, Toshiro | ||||||
著者 所属 | ||||||
旭サナック株式会社NC事業部 | ||||||
著者 所属 | ||||||
旭サナック株式会社NC事業部 | ||||||
著者 所属 | ||||||
埼玉大学教育学部(現九州大学大学院工学研究院知能機械システム部門) | ||||||
著者 所属(別言語) | ||||||
Asahi Sunac Corporation NC division | ||||||
著者 所属(別言語) | ||||||
Asahi Sunac Corporation NC division | ||||||
著者 所属(別言語) | ||||||
The Faculty of Education, Saitama University (Department of Intelligent Machinery & Systems Faculty of Engineering , Kyushu University) | ||||||
書誌情報 |
埼玉大学地域共同研究センター紀要 en : Report of Cooperative Research Center, Saitama University 巻 7, p. 14-19, 発行日 2007 |
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年月次 | ||||||
2006 | ||||||
出版者名 | ||||||
出版者 | 埼玉大学総合研究機構地域共同研究センター産学連携推進部門 | |||||
ISSN | ||||||
収録物識別子タイプ | ISSN | |||||
収録物識別子 | 13474758 | |||||
概要 | ||||||
内容記述タイプ | Other | |||||
内容記述 | Conventional diamond disc pad conditioning methods employed in chemical mechanical planarization (CMP) have presented several problems for integrated circuit (IC) manufacturers. These include diamond wear, which reduces pad life, and diamond fracture, which causes the semiconductor devices to be scratched by loose diamond fragments. In order to attempt to overcome these problems, a high-pressure micro jet (HPMJ) conditioning system, in which pressurized ultra pure water (UPW) ranging from 3 - 20 MPa is sprayed on the pad surface, is proposed and developed. In this study, it is demonstrated that the HPMJ can adapt the pad conditioning of device CMP and silicon CMP for the experiments. | |||||
資源タイプ | ||||||
内容記述タイプ | Other | |||||
内容記述 | text | |||||
フォーマット | ||||||
内容記述タイプ | Other | |||||
内容記述 | application/pdf | |||||
作成日 | ||||||
日付 | 2009-03-02 | |||||
日付タイプ | Created | |||||
アイテムID | ||||||
KY-AA11808968-07-05 |