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エポキシ系樹脂を用いたCMP用パッドの試作とその加工特性(第1報)
https://doi.org/10.24561/00016609
https://doi.org/10.24561/000166095db28bfd-5b2c-4f91-a902-c6d84a4ce71e
名前 / ファイル | ライセンス | アクション |
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KY-AA11808968-02-08.pdf (288.3 kB)
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Item type | 紀要論文 / Departmental Bulletin Paper(1) | |||||
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公開日 | 2009-06-02 | |||||
タイトル | ||||||
タイトル | エポキシ系樹脂を用いたCMP用パッドの試作とその加工特性(第1報) | |||||
言語 | ||||||
言語 | jpn | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | CMP | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Polishing pads | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Epoxy resin materials | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Removal rate | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | ILD | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | SiO2 film | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Slurry. | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
資源タイプ | departmental bulletin paper | |||||
ID登録 | ||||||
ID登録 | 10.24561/00016609 | |||||
ID登録タイプ | JaLC | |||||
タイトル(別言語) | ||||||
その他のタイトル | A Trial Production and Its Processing Characteristic of the Pad for CMP Using the Epoxy Resin (1st Report) | |||||
著者 |
片柳, 宏章
× 片柳, 宏章× 土肥, 俊郎× 谷澤, 和子× 木下, 将毅× 代田, 渉× 瀬山, 貴司× 河野, 恭幸 |
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著者 ローマ字 | ||||||
Hiroaki Katayanagi | ||||||
著者 ローマ字 | ||||||
Toshiroh K. Doy | ||||||
著者 ローマ字 | ||||||
Kazuko Tanizawa | ||||||
著者 ローマ字 | ||||||
Masaki Kinoshita | ||||||
著者 ローマ字 | ||||||
Wataru Shirota | ||||||
著者 ローマ字 | ||||||
Takashi Seyama | ||||||
著者 ローマ字 | ||||||
Yasuyuki Kawano | ||||||
著者 所属 | ||||||
埼玉大学大学院教育学研究料 | ||||||
著者 所属 | ||||||
埼玉大学教育学部 | ||||||
著者 所属 | ||||||
埼玉大学教育学部 | ||||||
著者 所属 | ||||||
埼玉大学大学院教育学研究料 | ||||||
著者 所属 | ||||||
埼玉大学教育学部 | ||||||
著者 所属 | ||||||
埼玉大学教育学部 | ||||||
著者 所属 | ||||||
三井化学株式会社 | ||||||
著者 所属(別言語) | ||||||
Graduate School of Education, Saitama University. | ||||||
著者 所属(別言語) | ||||||
Faculty of Education, Saitama University. | ||||||
著者 所属(別言語) | ||||||
Faculty of Education, Saitama University. | ||||||
著者 所属(別言語) | ||||||
Graduate School of Education, Saitama University. | ||||||
著者 所属(別言語) | ||||||
Faculty of Education, Saitama University. | ||||||
著者 所属(別言語) | ||||||
Faculty of Education, Saitama University. | ||||||
著者 所属(別言語) | ||||||
MITSUI CHEMICALS, INS. | ||||||
書誌情報 |
埼玉大学地域共同研究センター紀要 en : Report of Cooperative Research Center, Saitama University 巻 2, p. 27-32, 発行日 2002 |
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年月次 | ||||||
2001 | ||||||
出版者名 | ||||||
出版者 | 埼玉大学地域共同研究センター | |||||
ISSN | ||||||
収録物識別子タイプ | ISSN | |||||
収録物識別子 | 13474758 | |||||
概要 | ||||||
内容記述タイプ | Other | |||||
内容記述 | For the next generation LSI device, further highly efficient and multi-layer interconnection are required. To realize those purposes, CMP technology is serving as an essential role for polishing technology. Various pads are currently used for CMP, however, many problems such as how to reduce degradation of pads in the process of polishing or how to enhance polishing efficiency are left behind.To cope with those problems, experimental approaches (or studies) were conducted by using new pads of new materials comparing with the pads available now. As a result, higher efficient polishing characteristics were observed in the experiments using new pads than in the experiments using conventional pads and the measures how to work on the experiments have been acquired. |
|||||
資源タイプ | ||||||
内容記述タイプ | Other | |||||
内容記述 | text | |||||
フォーマット | ||||||
内容記述タイプ | Other | |||||
内容記述 | application/pdf | |||||
作成日 | ||||||
日付 | 2009-06-18 | |||||
日付タイプ | Created | |||||
アイテムID | ||||||
KY-AA11808968-02-08 |