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最適に回収されたスラリーを用いたタングステンCMPの評価
https://doi.org/10.24561/00016725
https://doi.org/10.24561/00016725f8c7c521-3720-4ff0-89ad-b2ac8b39ef0f
名前 / ファイル | ライセンス | アクション |
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KY-AA11808968-05-04.pdf (231.3 kB)
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Item type | 紀要論文 / Departmental Bulletin Paper(1) | |||||
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公開日 | 2009-05-01 | |||||
タイトル | ||||||
タイトル | 最適に回収されたスラリーを用いたタングステンCMPの評価 | |||||
言語 | ||||||
言語 | jpn | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Tungsten(W)-CMP | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Slurry | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Recycling | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
資源タイプ | departmental bulletin paper | |||||
ID登録 | ||||||
ID登録 | 10.24561/00016725 | |||||
ID登録タイプ | JaLC | |||||
タイトル(別言語) | ||||||
その他のタイトル | Evaluation of Tungsten CMP by using Optimized Recovery Slurry | |||||
著者 |
小島, 泉里
× 小島, 泉里× 船越, 考雄× 堀, 徹× 阿部, 嗣× 土肥, 俊郎 |
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著者 ローマ字 | ||||||
Ojima, Senri | ||||||
著者 ローマ字 | ||||||
Funakohi, ,Takao | ||||||
著者 ローマ字 | ||||||
Hori, Toru | ||||||
著者 ローマ字 | ||||||
Abe, Mitsugu | ||||||
著者 ローマ字 | ||||||
Doi, Toshiro | ||||||
著者 所属 | ||||||
野村マイクロ・サイエンス株式会社 | ||||||
著者 所属 | ||||||
埼玉大学教育学部 | ||||||
著者 所属 | ||||||
野村マイクロ・サイエンス株式会社 | ||||||
著者 所属 | ||||||
野村マイクロ・サイエンス株式会社 | ||||||
著者 所属 | ||||||
埼玉大学教育学部 | ||||||
著者 所属(別言語) | ||||||
Functional Product Div. Development Headquarters Nomura Micro Science Co., Ltd. | ||||||
著者 所属(別言語) | ||||||
Department of Education Saitama University | ||||||
著者 所属(別言語) | ||||||
Functional Product Div. Development Headquarters Nomura Micro Science Co., Ltd. | ||||||
著者 所属(別言語) | ||||||
Functional Product Div. Development Headquarters Nomura Micro Science Co., Ltd. | ||||||
著者 所属(別言語) | ||||||
Department of Education Saitama University | ||||||
書誌情報 |
埼玉大学地域共同研究センター紀要 en : Report of Cooperative Research Center, Saitama University 巻 5, p. 13-17, 発行日 2005 |
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年月次 | ||||||
2004 | ||||||
出版者名 | ||||||
出版者 | 埼玉大学地域共同研究センター | |||||
出版者名(別言語) | ||||||
出版者 | Cooperative Research Center, Saitama University | |||||
ISSN | ||||||
収録物識別子タイプ | ISSN | |||||
収録物識別子 | 13474758 | |||||
概要 | ||||||
内容記述タイプ | Other | |||||
内容記述 | Chemical Mechanical Polishing (CMP) is essential for the manufacturing of recent high-performance electronic device. However, for the CMP process, huge amount of slurry is used, which is to be disposed after being used only once. From the viewpoint of reduction of environmental burdens, this study was made for exploring the possibility of recycling of slurry by focusing on the slurry used for Tungsten CMP. For that purpose, we recovered the slurry used for polishing and then tried to reuse it for polishing again. As a method for evaluation, we made comparisons of removal rates between new slurry and recovered slurry. The results shows that when recovering the slurry during CMP, it contained the water remained on the surface of the polishing pad after dressing, by which slurry was diluted and caused the reduction of removal rate of Tungsten film. However, it was found that when making polishing of Tungsten film using the slurry recovered without being diluted with water, the same level of removal rate as new slurry is obtained. | |||||
資源タイプ | ||||||
内容記述タイプ | Other | |||||
内容記述 | text | |||||
フォーマット | ||||||
内容記述タイプ | Other | |||||
内容記述 | application/pdf | |||||
作成日 | ||||||
日付 | 2009-06-17 | |||||
日付タイプ | Created | |||||
アイテムID | ||||||
KY-AA11808968-05-04 |