WEKO3
アイテム
{"_buckets": {"deposit": "6b7d1e0d-cdbd-496c-bc1f-62c7f4511948"}, "_deposit": {"created_by": 3, "id": "16786", "owners": [3], "pid": {"revision_id": 0, "type": "depid", "value": "16786"}, "status": "published"}, "_oai": {"id": "oai:sucra.repo.nii.ac.jp:00016786", "sets": ["639"]}, "author_link": ["27526", "27527", "27524", "27523", "27525"], "item_120_alternative_title_1": {"attribute_name": "タイトル(別言語)", "attribute_value_mlt": [{"subitem_alternative_title": "Basic Study on W-CMP Slurry Recycle Technology"}]}, "item_120_biblio_info_8": {"attribute_name": "書誌情報", "attribute_value_mlt": [{"bibliographicIssueDates": {"bibliographicIssueDate": "2007", "bibliographicIssueDateType": "Issued"}, "bibliographicPageEnd": "10", "bibliographicPageStart": "7", "bibliographicVolumeNumber": "7", "bibliographic_titles": [{"bibliographic_title": "埼玉大学地域共同研究センター紀要"}, {"bibliographic_title": "Report of Cooperative Research Center, Saitama University", "bibliographic_titleLang": "en"}]}]}, "item_120_date_31": {"attribute_name": "作成日", "attribute_value_mlt": [{"subitem_date_issued_datetime": "2009-03-02", "subitem_date_issued_type": "Created"}]}, "item_120_description_19": {"attribute_name": "概要", "attribute_value_mlt": [{"subitem_description": "Chemical Mechanical Polishing (CMP) is essential for the manufacturing of recent high-performance electronic device. However, for the CMP process, huge amount of slurry is used, which is to be disposed after being used only once. From the viewpoint of reduction of environmental burdens, this study was made for exploring the possibility of recycling of slurry by focusing on the slurry used for Tungsten CMP. For that purpose, we collected the slurry used for polishing and then tried to reuse it for polishing again. As a method for evaluation, we made comparisons of removal rates between new slurry and recovered slurry. The results shows that when collecting the slurry during CMP, it contained the water remained on the surface of the polishing pad after conditioning, by which slurry was diluted and caused the reduction of removal rate of Tungsten film. However, it was found that when making polishing of Tungsten film using the slurry recovered without being diluted with water, the same level of removal rate as new slurry is obtained.", "subitem_description_type": "Other"}]}, "item_120_description_29": {"attribute_name": "資源タイプ", "attribute_value_mlt": [{"subitem_description": "text", "subitem_description_type": "Other"}]}, "item_120_description_30": {"attribute_name": "フォーマット", "attribute_value_mlt": [{"subitem_description": "application/pdf", "subitem_description_type": "Other"}]}, "item_120_identifier_registration": {"attribute_name": "ID登録", "attribute_value_mlt": [{"subitem_identifier_reg_text": "10.24561/00016780", "subitem_identifier_reg_type": "JaLC"}]}, "item_120_publisher_11": {"attribute_name": "出版者名", "attribute_value_mlt": [{"subitem_publisher": "埼玉大学総合研究機構地域共同研究センター産学連携推進部門"}]}, "item_120_source_id_14": {"attribute_name": "ISSN", "attribute_value_mlt": [{"subitem_source_identifier": "13474758", "subitem_source_identifier_type": "ISSN"}]}, "item_120_text_3": {"attribute_name": "著者 ローマ字", "attribute_value_mlt": [{"subitem_text_value": "Funakoshi, Takao"}, {"subitem_text_value": "Ojima, Senri"}, {"subitem_text_value": "Doi, Toshiro"}, {"subitem_text_value": "Kato, Eiko"}, {"subitem_text_value": "Abe, Mitsugu"}]}, "item_120_text_32": {"attribute_name": "アイテムID", "attribute_value_mlt": [{"subitem_text_value": "KY-AA11808968-07-03"}]}, "item_120_text_35": {"attribute_name": "公開日(XooNIps)", "attribute_value_mlt": [{"subitem_text_value": "Mar 3, 2009 09:00:00"}]}, "item_120_text_36": {"attribute_name": "記録日(XooNIps)", "attribute_value_mlt": [{"subitem_text_value": "2009-03-02"}]}, "item_120_text_37": {"attribute_name": "最終更新日(XooNIps)", "attribute_value_mlt": [{"subitem_text_value": "Mar 3, 2009 15:19:12"}]}, "item_120_text_38": {"attribute_name": "公開日(XooNIps)", "attribute_value_mlt": [{"subitem_text_value": "Mar 3, 2009 09:00:00"}]}, "item_120_text_39": {"attribute_name": "更新履歴(XooNIps)", "attribute_value_mlt": [{"subitem_text_value": "Mar 3, 2009 フリーキーワード, 抄録, キーワード を変更"}, {"subitem_text_value": "Mar 3, 2009 フリーキーワード, インデックス, 抄録, キーワード を変更"}]}, "item_120_text_4": {"attribute_name": "著者 所属", "attribute_value_mlt": [{"subitem_text_value": "野村マイクロ・サイエンス(株)"}, {"subitem_text_value": "野村マイクロ・サイエンス(株)"}, {"subitem_text_value": "埼玉大学教育学部"}, {"subitem_text_value": "埼玉大学教育学部"}, {"subitem_text_value": "野村マイクロ・サイエンス(株)"}]}, "item_120_text_40": {"attribute_name": "登録者(XooNIps)", "attribute_value_mlt": [{"subitem_text_value": "sucra_jim4"}]}, "item_120_text_41": {"attribute_name": "閲覧数(XooNIps)", "attribute_value_mlt": [{"subitem_text_value": "1729"}]}, "item_120_text_42": {"attribute_name": "ダウンロード数(XooNIps)", "attribute_value_mlt": [{"subitem_text_value": "5178"}]}, "item_120_text_43": {"attribute_name": "XooNIps_インデックス", "attribute_value_mlt": [{"subitem_text_value": "sucra_jim4/埼玉大学|Public/埼玉大学/教育学部|Public/ジャンル別/研究紀要/埼玉大学/地域共同研究センター紀要|Public/主題別/工学/機械工学/生産工学・加工学"}]}, "item_120_text_44": {"attribute_name": "XooNIps_ITEM_KEY", "attribute_value_mlt": [{"subitem_text_value": "3702"}]}, "item_120_text_5": {"attribute_name": "著者 所属(別言語)", "attribute_value_mlt": [{"subitem_text_value": "Nomura Micro Science Co.,Ltd"}, {"subitem_text_value": "Nomura Micro Science Co.,Ltd"}, {"subitem_text_value": "Faculty of Education, Saitama University"}, {"subitem_text_value": "Faculty of Education, Saitama University"}, {"subitem_text_value": "Nomura Micro Science Co.,Ltd"}]}, "item_120_text_9": {"attribute_name": "年月次", "attribute_value_mlt": [{"subitem_text_value": "2006"}]}, "item_creator": {"attribute_name": "著者", "attribute_type": "creator", "attribute_value_mlt": [{"creatorNames": [{"creatorName": "船越, 考雄"}, {"creatorName": "フナコシ, タカオ", "creatorNameLang": "ja-Kana"}], "nameIdentifiers": [{"nameIdentifier": "27523", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "小島, 泉里"}, {"creatorName": "オジマ, センリ", "creatorNameLang": "ja-Kana"}], "nameIdentifiers": [{"nameIdentifier": "27524", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "土肥, 俊郎"}, {"creatorName": "ドイ, トシロウ", "creatorNameLang": "ja-Kana"}], "nameIdentifiers": [{"nameIdentifier": "27525", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "加藤, 栄子"}, {"creatorName": "カトウ, エイコ", "creatorNameLang": "ja-Kana"}], "nameIdentifiers": [{"nameIdentifier": "27526", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "阿部, 嗣"}, {"creatorName": "アベ, ミツグ", "creatorNameLang": "ja-Kana"}], "nameIdentifiers": [{"nameIdentifier": "27527", "nameIdentifierScheme": "WEKO"}]}]}, "item_files": {"attribute_name": "ファイル情報", "attribute_type": "file", "attribute_value_mlt": [{"accessrole": "open_date", "date": [{"dateType": "Available", "dateValue": "2018-01-24"}], "displaytype": "detail", "download_preview_message": "", "file_order": 0, "filename": "KY-AA11808968-07-03.pdf", "filesize": [{"value": "766.3 kB"}], "format": "application/pdf", "future_date_message": "", "is_thumbnail": false, "licensetype": "license_free", "mimetype": "application/pdf", "size": 766300.0, "url": {"label": "KY-AA11808968-07-03.pdf", "url": "https://sucra.repo.nii.ac.jp/record/16786/files/KY-AA11808968-07-03.pdf"}, "version_id": "acd3db25-f0e1-4ee4-8b30-a1c701b9e71b"}]}, "item_keyword": {"attribute_name": "キーワード", "attribute_value_mlt": [{"subitem_subject": "CMP", "subitem_subject_scheme": "Other"}, {"subitem_subject": "Recycle", "subitem_subject_scheme": "Other"}, {"subitem_subject": "Tungsten", "subitem_subject_scheme": "Other"}]}, "item_language": {"attribute_name": "言語", "attribute_value_mlt": [{"subitem_language": "jpn"}]}, "item_resource_type": {"attribute_name": "資源タイプ", "attribute_value_mlt": [{"resourcetype": "departmental bulletin paper", "resourceuri": "http://purl.org/coar/resource_type/c_6501"}]}, "item_title": "タングステンCMPにおけるスラリーの再生に関する基礎的研究", "item_titles": {"attribute_name": "タイトル", "attribute_value_mlt": [{"subitem_title": "タングステンCMPにおけるスラリーの再生に関する基礎的研究"}]}, "item_type_id": "120", "owner": "3", "path": ["639"], "permalink_uri": "https://doi.org/10.24561/00016780", "pubdate": {"attribute_name": "公開日", "attribute_value": "2009-03-03"}, "publish_date": "2009-03-03", "publish_status": "0", "recid": "16786", "relation": {}, "relation_version_is_last": true, "title": ["タングステンCMPにおけるスラリーの再生に関する基礎的研究"], "weko_shared_id": -1}
タングステンCMPにおけるスラリーの再生に関する基礎的研究
https://doi.org/10.24561/00016780
https://doi.org/10.24561/00016780cc80d2a8-877a-46f8-ae71-0e30f2094903
名前 / ファイル | ライセンス | アクション |
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KY-AA11808968-07-03.pdf (766.3 kB)
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Item type | 紀要論文 / Departmental Bulletin Paper(1) | |||||
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公開日 | 2009-03-03 | |||||
タイトル | ||||||
タイトル | タングステンCMPにおけるスラリーの再生に関する基礎的研究 | |||||
言語 | ||||||
言語 | jpn | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | CMP | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Recycle | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Tungsten | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
資源タイプ | departmental bulletin paper | |||||
ID登録 | ||||||
ID登録 | 10.24561/00016780 | |||||
ID登録タイプ | JaLC | |||||
タイトル(別言語) | ||||||
その他のタイトル | Basic Study on W-CMP Slurry Recycle Technology | |||||
著者 |
船越, 考雄
× 船越, 考雄× 小島, 泉里× 土肥, 俊郎× 加藤, 栄子× 阿部, 嗣 |
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著者 ローマ字 | ||||||
Funakoshi, Takao | ||||||
著者 ローマ字 | ||||||
Ojima, Senri | ||||||
著者 ローマ字 | ||||||
Doi, Toshiro | ||||||
著者 ローマ字 | ||||||
Kato, Eiko | ||||||
著者 ローマ字 | ||||||
Abe, Mitsugu | ||||||
著者 所属 | ||||||
野村マイクロ・サイエンス(株) | ||||||
著者 所属 | ||||||
野村マイクロ・サイエンス(株) | ||||||
著者 所属 | ||||||
埼玉大学教育学部 | ||||||
著者 所属 | ||||||
埼玉大学教育学部 | ||||||
著者 所属 | ||||||
野村マイクロ・サイエンス(株) | ||||||
著者 所属(別言語) | ||||||
Nomura Micro Science Co.,Ltd | ||||||
著者 所属(別言語) | ||||||
Nomura Micro Science Co.,Ltd | ||||||
著者 所属(別言語) | ||||||
Faculty of Education, Saitama University | ||||||
著者 所属(別言語) | ||||||
Faculty of Education, Saitama University | ||||||
著者 所属(別言語) | ||||||
Nomura Micro Science Co.,Ltd | ||||||
書誌情報 |
埼玉大学地域共同研究センター紀要 en : Report of Cooperative Research Center, Saitama University 巻 7, p. 7-10, 発行日 2007 |
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年月次 | ||||||
2006 | ||||||
出版者名 | ||||||
出版者 | 埼玉大学総合研究機構地域共同研究センター産学連携推進部門 | |||||
ISSN | ||||||
収録物識別子タイプ | ISSN | |||||
収録物識別子 | 13474758 | |||||
概要 | ||||||
内容記述タイプ | Other | |||||
内容記述 | Chemical Mechanical Polishing (CMP) is essential for the manufacturing of recent high-performance electronic device. However, for the CMP process, huge amount of slurry is used, which is to be disposed after being used only once. From the viewpoint of reduction of environmental burdens, this study was made for exploring the possibility of recycling of slurry by focusing on the slurry used for Tungsten CMP. For that purpose, we collected the slurry used for polishing and then tried to reuse it for polishing again. As a method for evaluation, we made comparisons of removal rates between new slurry and recovered slurry. The results shows that when collecting the slurry during CMP, it contained the water remained on the surface of the polishing pad after conditioning, by which slurry was diluted and caused the reduction of removal rate of Tungsten film. However, it was found that when making polishing of Tungsten film using the slurry recovered without being diluted with water, the same level of removal rate as new slurry is obtained. | |||||
資源タイプ | ||||||
内容記述タイプ | Other | |||||
内容記述 | text | |||||
フォーマット | ||||||
内容記述タイプ | Other | |||||
内容記述 | application/pdf | |||||
作成日 | ||||||
日付 | 2009-03-02 | |||||
日付タイプ | Created | |||||
アイテムID | ||||||
KY-AA11808968-07-03 |