{"created":"2023-05-15T15:24:57.746310+00:00","id":12398,"links":{},"metadata":{"_buckets":{"deposit":"87ca97a8-803c-4e9e-b4b4-90d573c7687b"},"_deposit":{"created_by":3,"id":"12398","owners":[3],"pid":{"revision_id":0,"type":"depid","value":"12398"},"status":"published"},"_oai":{"id":"oai:sucra.repo.nii.ac.jp:00012398","sets":["84:295"]},"author_link":["19361","19359","19360","19358"],"item_119_biblio_info_8":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2004","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"1","bibliographicPageEnd":"92","bibliographicPageStart":"85","bibliographicVolumeNumber":"47","bibliographic_titles":[{"bibliographic_title":"JSME international journal. Series C, Mechanical systems, machine elements and manufacturing"}]}]},"item_119_date_31":{"attribute_name":"作成日","attribute_value_mlt":[{"subitem_date_issued_datetime":"2010-02-23","subitem_date_issued_type":"Created"}]},"item_119_description_19":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"This paper presents a corrective Cu-CMP (Chemical Mechanical Polishing) method for obtaining higher planarized surface by forming laser aggregation particles on recessed areas of uneven copper surface before polishing. At first, the component analysis and formation condition of aggregated particles were investigated, which is obtained by laser irradiation into the slurry on the copper surface. This result indicated that the aggregated marks were purely made of SiO_2 particles contained in slurry and the height of particle aggregation could be controlled by laser irradiation condition. Next, proposed planarization method for uneven surface of copper layer was attempted. As the polishing progressed, the height of aggregated marks was reduced. Then, it was confirmed that the aggregated marks play a role of masks, and no material removal at the bottom surface of recessed areas takes place during the polishing. This process made it possible to realize high planarity on copper surface.","subitem_description_type":"Abstract"}]},"item_119_description_21":{"attribute_name":"注記","attribute_value_mlt":[{"subitem_description":"rights: 社団法人日本機械学会\nrights: 本文データは学協会の許諾に基づきCiNiiから複製したものである\nrelation: IsVersionOf:http://ci.nii.ac.jp/naid/110004820711","subitem_description_type":"Other"}]},"item_119_description_29":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"subitem_description":"text","subitem_description_type":"Other"}]},"item_119_description_30":{"attribute_name":"フォーマット","attribute_value_mlt":[{"subitem_description":"application/pdf","subitem_description_type":"Other"}]},"item_119_publisher_11":{"attribute_name":"出版者名","attribute_value_mlt":[{"subitem_publisher":"社団法人日本機械学会"}]},"item_119_relation_16":{"attribute_name":"DOI","attribute_value_mlt":[{"subitem_relation_type":"isIdenticalTo","subitem_relation_type_id":{"subitem_relation_type_id_text":"info:doi/10.1299/jsmec.47.85","subitem_relation_type_select":"DOI"}}]},"item_119_source_id_14":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"13447653","subitem_source_identifier_type":"ISSN"}]},"item_119_text_27":{"attribute_name":"版","attribute_value_mlt":[{"subitem_text_value":"[出版社版]"}]},"item_119_text_3":{"attribute_name":"著者 ローマ字","attribute_value_mlt":[{"subitem_text_value":"TSUJIO, Ryosuke"},{"subitem_text_value":"MIYOSHI, Takashi"},{"subitem_text_value":"TAKAYA, Yasuhiro"},{"subitem_text_value":"KIMURA, Keiichi"}]},"item_119_text_32":{"attribute_name":"アイテムID","attribute_value_mlt":[{"subitem_text_value":"A1003344"}]},"item_119_text_4":{"attribute_name":"著者 所属","attribute_value_mlt":[{"subitem_text_value":"大阪大学工学研究科機械システム工学専攻"},{"subitem_text_value":"大阪大学工学研究科機械システム工学専攻"},{"subitem_text_value":"大阪大学工学研究科機械システム工学専攻"},{"subitem_text_value":"埼玉大学教育学部"}]},"item_119_text_5":{"attribute_name":"著者 所属(別言語)","attribute_value_mlt":[{"subitem_text_value":"Department of Mechanical Engineering and Systems, Osaka University"},{"subitem_text_value":"Department of Mechanical Engineering and Systems, Osaka University"},{"subitem_text_value":"Department of Mechanical Engineering and Systems, Osaka University"},{"subitem_text_value":"Faculty of Education, Saitama University"}]},"item_119_text_9":{"attribute_name":"年月次","attribute_value_mlt":[{"subitem_text_value":"2004-3"}]},"item_119_version_type_28":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"辻尾, 良輔"}],"nameIdentifiers":[{"nameIdentifier":"19358","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"三好, 隆志"}],"nameIdentifiers":[{"nameIdentifier":"19359","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"高谷, 裕浩"}],"nameIdentifiers":[{"nameIdentifier":"19360","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"木村, 景一"}],"nameIdentifiers":[{"nameIdentifier":"19361","nameIdentifierScheme":"WEKO"}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2018-01-24"}],"displaytype":"detail","filename":"A1003344.pdf","filesize":[{"value":"1.4 MB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"A1003344.pdf","url":"https://sucra.repo.nii.ac.jp/record/12398/files/A1003344.pdf"},"version_id":"1831b6c4-dd03-4046-95db-5ef7ad6c567a"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"Cu-CMP","subitem_subject_scheme":"Other"},{"subitem_subject":"Optical Radiation Pressure","subitem_subject_scheme":"Other"},{"subitem_subject":"SiO_2 Particle","subitem_subject_scheme":"Other"},{"subitem_subject":"Surface Planarization","subitem_subject_scheme":"Other"},{"subitem_subject":"Laser Assisted Polishing","subitem_subject_scheme":"Other"},{"subitem_subject":"Laser Trapping","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"Fundamental Properties of Chemical Mechanical Polishing for Copper Layer Assisted by Optical Radiation Pressure(<Special Issue>Advanced Manufacturing Technology)","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Fundamental Properties of Chemical Mechanical Polishing for Copper Layer Assisted by Optical Radiation Pressure(<Special Issue>Advanced Manufacturing Technology)"}]},"item_type_id":"119","owner":"3","path":["295"],"pubdate":{"attribute_name":"公開日","attribute_value":"2010-02-23"},"publish_date":"2010-02-23","publish_status":"0","recid":"12398","relation_version_is_last":true,"title":["Fundamental Properties of Chemical Mechanical Polishing for Copper Layer Assisted by Optical Radiation Pressure(<Special Issue>Advanced Manufacturing Technology)"],"weko_creator_id":"3","weko_shared_id":-1},"updated":"2023-05-16T13:07:07.719068+00:00"}