@article{oai:sucra.repo.nii.ac.jp:00012643,
 author = {池野, 順一 and 澁谷, 秀雄 and 深澤, 隆 and 不破, 徳人 and 鈴木, 浩文 and 堀内, 宰},
 issue = {673},
 journal = {日本機械学會論文集. C編},
 month = {},
 note = {Grinding performance of fine abrasive grinding wheel to silicon wafer were investigated. In this study, thin-plate silica powder, tens μm in length and 1 μm in width, were applied as a abrasive for grinding wheel. The grinding wheel were fabricated using a electrophoretic deposition phenomenon, it was called "EPD pellet", and thin-plate silica abrasives could be arranged in a one-way direction in the EPD pellet. Grinding efficiency of thin-plate silica EPD pellet was twice as high as a conventional EPD pellet which was consist of spherical silica abrasive. Warp of thin-wafer, 150 μm in thickness ground by diamond wheel, were decreased with the progress of EPD grinding. This result shows that a residual strain by a diamond wheel could be removed by EPD grinding., text, application/pdf},
 pages = {2791--2796},
 title = {薄片状シリカEPDペレットによるシリコンウエハの研削特性(機械要素,潤滑,工作,生産管理など)},
 volume = {68},
 year = {2002},
 yomi = {イケノ, ジュンイチ and シブタニ, ヒデオ and フカザワ, タカシ and フワ, ナルト and スズキ, ヒロフミ and ホリウチ, オサム}
}