{"created":"2023-05-15T15:25:08.071686+00:00","id":12643,"links":{},"metadata":{"_buckets":{"deposit":"7a92c705-e5e0-4002-b74d-bdcc0b17f170"},"_deposit":{"created_by":3,"id":"12643","owners":[3],"pid":{"revision_id":0,"type":"depid","value":"12643"},"status":"published"},"_oai":{"id":"oai:sucra.repo.nii.ac.jp:00012643","sets":["94:426"]},"author_link":["19712","19713","19711","19714","19710","18376"],"item_119_alternative_title_1":{"attribute_name":"タイトル（別言語）","attribute_value_mlt":[{"subitem_alternative_title":"Grinding Performance of Thin-Plate Silica EPD Pellet to Silicon Wafer"}]},"item_119_biblio_info_8":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2002","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"673","bibliographicPageEnd":"2796","bibliographicPageStart":"2791","bibliographicVolumeNumber":"68","bibliographic_titles":[{"bibliographic_title":"日本機械学會論文集. C編"}]}]},"item_119_date_31":{"attribute_name":"作成日","attribute_value_mlt":[{"subitem_date_issued_datetime":"2007-03-05","subitem_date_issued_type":"Created"}]},"item_119_description_19":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"Grinding performance of fine abrasive grinding wheel to silicon wafer were investigated. In this study, thin-plate silica powder, tens μm in length and 1 μm in width, were applied as a abrasive for grinding wheel. The grinding wheel were fabricated using a electrophoretic deposition phenomenon, it was called \"EPD pellet\", and thin-plate silica abrasives could be arranged in a one-way direction in the EPD pellet. Grinding efficiency of thin-plate silica EPD pellet was twice as high as a conventional EPD pellet which was consist of spherical silica abrasive. Warp of thin-wafer, 150 μm in thickness ground by diamond wheel, were decreased with the progress of EPD grinding. This result shows that a residual strain by a diamond wheel could be removed by EPD grinding.","subitem_description_type":"Abstract"}]},"item_119_description_29":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"subitem_description":"text","subitem_description_type":"Other"}]},"item_119_description_30":{"attribute_name":"フォーマット","attribute_value_mlt":[{"subitem_description":"application/pdf","subitem_description_type":"Other"}]},"item_119_publisher_11":{"attribute_name":"出版者名","attribute_value_mlt":[{"subitem_publisher":"社団法人日本機械学会"}]},"item_119_source_id_14":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"03875024","subitem_source_identifier_type":"ISSN"}]},"item_119_text_3":{"attribute_name":"著者 ローマ字","attribute_value_mlt":[{"subitem_text_value":"IKENO, Jun-ichi"},{"subitem_text_value":"SHIBUTANI, Hideo"},{"subitem_text_value":"FUKAZAWA, Takashi"},{"subitem_text_value":"FUWA, Naruto"},{"subitem_text_value":"SUZUKI, Hirofumi"},{"subitem_text_value":"HORIUCHI, Osamu"}]},"item_119_text_32":{"attribute_name":"アイテムID","attribute_value_mlt":[{"subitem_text_value":"A3000049"}]},"item_119_text_4":{"attribute_name":"著者 所属","attribute_value_mlt":[{"subitem_text_value":"埼玉大学大学院理工学研究科"}]},"item_119_text_5":{"attribute_name":"著者 所属(別言語)","attribute_value_mlt":[{"subitem_text_value":"Graduate School of Science and Engineering, Saitama University"}]},"item_119_text_9":{"attribute_name":"年月次","attribute_value_mlt":[{"subitem_text_value":"2002-09"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"池野, 順一"},{"creatorName":"イケノ, ジュンイチ","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{},{}]},{"creatorNames":[{"creatorName":"澁谷, 秀雄"},{"creatorName":"シブタニ, ヒデオ","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"深澤, 隆"},{"creatorName":"フカザワ, タカシ","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"不破, 徳人"},{"creatorName":"フワ, ナルト","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"鈴木, 浩文"},{"creatorName":"スズキ, ヒロフミ","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"堀内, 宰"},{"creatorName":"ホリウチ, オサム","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2018-01-24"}],"displaytype":"detail","filename":"A3000049.pdf","filesize":[{"value":"678.0 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"A3000049.pdf","url":"https://sucra.repo.nii.ac.jp/record/12643/files/A3000049.pdf"},"version_id":"c2ea549a-f3b2-4e6c-998d-997f9e9d4081"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"Ultra-Precision Machining","subitem_subject_scheme":"Other"},{"subitem_subject":"Grinding","subitem_subject_scheme":"Other"},{"subitem_subject":"Abrasive Grain","subitem_subject_scheme":"Other"},{"subitem_subject":"Grinding Wheel","subitem_subject_scheme":"Other"},{"subitem_subject":"Silicon Wafer","subitem_subject_scheme":"Other"},{"subitem_subject":"Mirror Grinding","subitem_subject_scheme":"Other"},{"subitem_subject":"Electrophoretic Deposition","subitem_subject_scheme":"Other"},{"subitem_subject":"EPD","subitem_subject_scheme":"Other"},{"subitem_subject":"Silica Fine Abrasive","subitem_subject_scheme":"Other"},{"subitem_subject":"Thin-Plate Silica Powder","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"薄片状シリカEPDペレットによるシリコンウエハの研削特性(機械要素,潤滑,工作,生産管理など)","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"薄片状シリカEPDペレットによるシリコンウエハの研削特性(機械要素,潤滑,工作,生産管理など)"}]},"item_type_id":"119","owner":"3","path":["426"],"pubdate":{"attribute_name":"公開日","attribute_value":"2007-09-10"},"publish_date":"2007-09-10","publish_status":"0","recid":"12643","relation_version_is_last":true,"title":["薄片状シリカEPDペレットによるシリコンウエハの研削特性(機械要素,潤滑,工作,生産管理など)"],"weko_creator_id":"3","weko_shared_id":-1},"updated":"2023-05-16T12:57:08.434891+00:00"}