{"created":"2023-05-15T15:27:40.323801+00:00","id":16571,"links":{},"metadata":{"_buckets":{"deposit":"3e288a5d-470a-4f36-be33-cb9f366ef9d8"},"_deposit":{"created_by":3,"id":"16571","owners":[3],"pid":{"revision_id":0,"type":"depid","value":"16571"},"status":"published"},"_oai":{"id":"oai:sucra.repo.nii.ac.jp:00016571","sets":["95:239:633"]},"author_link":["26936","26937","26939","26938"],"item_120_alternative_title_1":{"attribute_name":"タイトル（別言語）","attribute_value_mlt":[{"subitem_alternative_title":"Study on Planarization CMP Technology for ULSI Device Wafers : The Possibility of Abrasive Free CMP"}]},"item_120_biblio_info_8":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2001","bibliographicIssueDateType":"Issued"},"bibliographicPageEnd":"14","bibliographicPageStart":"8","bibliographicVolumeNumber":"1","bibliographic_titles":[{"bibliographic_title":"埼玉大学地域共同研究センター紀要"},{"bibliographic_title":"Report of Cooperative Research Center, Saitama University","bibliographic_titleLang":"en"}]}]},"item_120_date_31":{"attribute_name":"作成日","attribute_value_mlt":[{"subitem_date_issued_datetime":"2009-06-25","subitem_date_issued_type":"Created"}]},"item_120_description_19":{"attribute_name":"概要","attribute_value_mlt":[{"subitem_description":"超LSIデバイスの平坦化技術としてCMP(Chemical Mechanical Polishing)技術の重要性は年々高まってきている。従来の平坦化CMPプロセスでは硬質のポリウレタンからなる研磨パッド上に研磨砥粒を含む研磨液(スラリー)を流し、被研磨物と研磨パッドを相対運動させることにより平坦化CMPをおこなっている。しかし、従来のCMPプロセスには解決すべき点があり、また今後の加工精度の要求事項への対応が困難であるといった問題がある。この問題を解決するため新しい平坦化CMPプロセスとして固定砥粒方式の平坦化CMPが注目を浴びている。\n本研究では、固定砥粒による平坦化cMPを実現すべく、従来の研磨パッドとは全く異なった、極細繊維からなる織物の研磨パッドの考案・試作を行ない、同パッドを用いて研磨パッドにも研磨液にも砥粒を使用しないで研磨を行なうクーラント方式cMPの可能性とcMP特性の把握・評価を行なった。その結果、Cu-CMPにおいては研磨パッドにも研磨液にも砥粒を使用しないクーラント方式CMP実現の見通しを得た。ただし、SiO2-CMPでは必ずしも満足する結果が得られているわけでなく、今後の検討課題である。","subitem_description_type":"Other"}]},"item_120_description_29":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"subitem_description":"text","subitem_description_type":"Other"}]},"item_120_description_30":{"attribute_name":"フォーマット","attribute_value_mlt":[{"subitem_description":"application/pdf","subitem_description_type":"Other"}]},"item_120_identifier_registration":{"attribute_name":"ID登録","attribute_value_mlt":[{"subitem_identifier_reg_text":"10.24561/00016565","subitem_identifier_reg_type":"JaLC"}]},"item_120_publisher_11":{"attribute_name":"出版者名","attribute_value_mlt":[{"subitem_publisher":"埼玉大学地域共同研究センター"}]},"item_120_source_id_14":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"13474758","subitem_source_identifier_type":"ISSN"}]},"item_120_text_3":{"attribute_name":"著者 ローマ字","attribute_value_mlt":[{"subitem_text_value":"Toshihiro Kobayashi"},{"subitem_text_value":"Hisatomo Ohno"},{"subitem_text_value":"Takabumi Marukawa"},{"subitem_text_value":"Toshiroh K. Doy"}]},"item_120_text_32":{"attribute_name":"アイテムID","attribute_value_mlt":[{"subitem_text_value":"KY-AA11808968-01-03"}]},"item_120_text_4":{"attribute_name":"著者 所属","attribute_value_mlt":[{"subitem_text_value":"日本ミクロコーティング株式会社"},{"subitem_text_value":"日本ミクロコーティング株式会社"},{"subitem_text_value":"日本ミクロコーティング株式会社"},{"subitem_text_value":"埼玉大学教育学部"}]},"item_120_text_5":{"attribute_name":"著者 所属(別言語)","attribute_value_mlt":[{"subitem_text_value":"Nihon Micro Coating Co., Ltd."},{"subitem_text_value":"Nihon Micro Coating Co., Ltd."},{"subitem_text_value":"Nihon Micro Coating Co., Ltd."},{"subitem_text_value":"Faculty of Education, Saitama University"}]},"item_120_text_9":{"attribute_name":"年月次","attribute_value_mlt":[{"subitem_text_value":"2000"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"小林, 俊裕"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"多, 久智"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"丸川, 隆文"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"土肥, 俊郎"}],"nameIdentifiers":[{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2018-01-24"}],"displaytype":"detail","filename":"KY-AA11808968-01-03.pdf","filesize":[{"value":"402.0 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"KY-AA11808968-01-03.pdf","url":"https://sucra.repo.nii.ac.jp/record/16571/files/KY-AA11808968-01-03.pdf"},"version_id":"17fc99e6-d713-44cc-9fcd-eb5621b24b1b"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"平坦化CMP","subitem_subject_scheme":"Other"},{"subitem_subject":"Cu-CMP","subitem_subject_scheme":"Other"},{"subitem_subject":"SiO2-CMP","subitem_subject_scheme":"Other"},{"subitem_subject":"固定砥粒","subitem_subject_scheme":"Other"},{"subitem_subject":"アプレツシブフリー","subitem_subject_scheme":"Other"},{"subitem_subject":"スラリー","subitem_subject_scheme":"Other"},{"subitem_subject":"均一性","subitem_subject_scheme":"Other"},{"subitem_subject":"織物パッド","subitem_subject_scheme":"Other"},{"subitem_subject":"プラナリゼーシヨン","subitem_subject_scheme":"Other"},{"subitem_subject":"クーラント方式CMP(完全アプレツシブフリーCMP)","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"departmental bulletin paper","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"超LSIデバイスウェハの平坦化CMPに関する研究 : スラリーフリーCMPの可能性 (平面精密研磨に関する研究) <研究報告>","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"超LSIデバイスウェハの平坦化CMPに関する研究 : スラリーフリーCMPの可能性 (平面精密研磨に関する研究) <研究報告>"}]},"item_type_id":"120","owner":"3","path":["633"],"pubdate":{"attribute_name":"公開日","attribute_value":"2009-06-12"},"publish_date":"2009-06-12","publish_status":"0","recid":"16571","relation_version_is_last":true,"title":["超LSIデバイスウェハの平坦化CMPに関する研究 : スラリーフリーCMPの可能性 (平面精密研磨に関する研究) <研究報告>"],"weko_creator_id":"3","weko_shared_id":-1},"updated":"2023-05-15T18:16:43.832906+00:00"}