@article{oai:sucra.repo.nii.ac.jp:00016614,
 author = {浜元, 伸二 and 土肥, 俊郎 and 横山, 健三},
 journal = {埼玉大学地域共同研究センター紀要, Report of Cooperative Research Center, Saitama University},
 month = {},
 note = {The influence of three different ion type surfactants on fumed silica slurry was studied. The increase of removal rate was observed when the small amount of longer alkyl chain anionic surfactant was added to the slurry. The addition of cationic surfactant caused the significant decrease of removal rate. The addition of nonionic surfactant showed the moderate decrease of removal rate. These differences of polishing performances are considered to be caused by the interaction between surfactants and abrasives/SiO2 film formed over silicon wafer., text, application/pdf},
 pages = {23--26},
 title = {CMP用スラリーにおける界面活性剤の加工特性に及ぼす挙動},
 volume = {2},
 year = {2002}
}