{"created":"2023-05-15T15:27:42.578294+00:00","id":16622,"links":{},"metadata":{"_buckets":{"deposit":"cd8a571f-555e-401f-9edc-2c13b801f76b"},"_deposit":{"created_by":3,"id":"16622","owners":[3],"pid":{"revision_id":0,"type":"depid","value":"16622"},"status":"published"},"_oai":{"id":"oai:sucra.repo.nii.ac.jp:00016622","sets":["95:239:634"]},"author_link":["27077","27078","27076"],"item_120_alternative_title_1":{"attribute_name":"タイトル（別言語）","attribute_value_mlt":[{"subitem_alternative_title":"Study on Planarization CMP Technology for ULSI Device Wafers : The Planarity Performance of Cu CMP"}]},"item_120_biblio_info_8":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2002","bibliographicIssueDateType":"Issued"},"bibliographicPageEnd":"66","bibliographicPageStart":"60","bibliographicVolumeNumber":"2","bibliographic_titles":[{"bibliographic_title":"埼玉大学地域共同研究センター紀要"},{"bibliographic_title":"Report of Cooperative Research Center, Saitama University","bibliographic_titleLang":"en"}]}]},"item_120_date_31":{"attribute_name":"作成日","attribute_value_mlt":[{"subitem_date_issued_datetime":"2009-06-18","subitem_date_issued_type":"Created"}]},"item_120_description_19":{"attribute_name":"概要","attribute_value_mlt":[{"subitem_description":"超LSIデバイスの平坦化CMP(Chemical Mechanical Planrizaition)技術の重要性は、微細化と配線の多層化を目指して年々高まってきている。従来の平坦化CMPプロセスでは硬質のポリウレタンからなる研磨パッドとウェハとの間にスラリーを供給しつつ、両者の相対運動で平坦化加工を行なうが厳しい加工精度の要求事項への対応が困難になってきている。そこで本研究では、極細繊維からなる織物の新しい研磨パッドの考案・試作を行ない、とくにCu-CMPにおいて有効と思われる研磨パッド「Upc-160」を開発1)しするとともに、アプレツシブフリー方式のCMP法の可能性を追求し、これまでに研磨性能の調査を行なってきた。今回はさらに平坦化性能について調査を行なったのでここに報告する。","subitem_description_type":"Other"}]},"item_120_description_29":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"subitem_description":"text","subitem_description_type":"Other"}]},"item_120_description_30":{"attribute_name":"フォーマット","attribute_value_mlt":[{"subitem_description":"application/pdf","subitem_description_type":"Other"}]},"item_120_identifier_registration":{"attribute_name":"ID登録","attribute_value_mlt":[{"subitem_identifier_reg_text":"10.24561/00016616","subitem_identifier_reg_type":"JaLC"}]},"item_120_publisher_11":{"attribute_name":"出版者名","attribute_value_mlt":[{"subitem_publisher":"埼玉大学地域共同研究センター"}]},"item_120_source_id_14":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"13474758","subitem_source_identifier_type":"ISSN"}]},"item_120_text_3":{"attribute_name":"著者 ローマ字","attribute_value_mlt":[{"subitem_text_value":"Toshihiro Kobayashi"},{"subitem_text_value":"Hisatomo Ohno"},{"subitem_text_value":"Toshiroh K. Doy"}]},"item_120_text_32":{"attribute_name":"アイテムID","attribute_value_mlt":[{"subitem_text_value":"KY-AA11808968-02-16"}]},"item_120_text_4":{"attribute_name":"著者 所属","attribute_value_mlt":[{"subitem_text_value":"日本ミクロコーティング株式会社"},{"subitem_text_value":"日本ミクロコーティング株式会社"},{"subitem_text_value":"埼玉大学教育学部"}]},"item_120_text_5":{"attribute_name":"著者 所属(別言語)","attribute_value_mlt":[{"subitem_text_value":"Nihon Micro Coating Co., Ltd."},{"subitem_text_value":"Nihon Micro Coating Co., Ltd."},{"subitem_text_value":"Faculty of Education, Saitama University"}]},"item_120_text_9":{"attribute_name":"年月次","attribute_value_mlt":[{"subitem_text_value":"2001"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"小林, 俊裕"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"多, 久智"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"土肥, 俊郎"}],"nameIdentifiers":[{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2018-01-24"}],"displaytype":"detail","filename":"KY-AA11808968-02-16.pdf","filesize":[{"value":"471.4 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"KY-AA11808968-02-16.pdf","url":"https://sucra.repo.nii.ac.jp/record/16622/files/KY-AA11808968-02-16.pdf"},"version_id":"e51e5423-9a10-4af1-a1b6-ad4c9988bf5f"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"Cu-CMP","subitem_subject_scheme":"Other"},{"subitem_subject":"織物パッド","subitem_subject_scheme":"Other"},{"subitem_subject":"平坦化","subitem_subject_scheme":"Other"},{"subitem_subject":"ステップハイト","subitem_subject_scheme":"Other"},{"subitem_subject":"デイツシング","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"departmental bulletin paper","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"超LSIデバイスウェハの平坦化CMPに関する研究 : Cu-CMPにおける平坦化性能","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"超LSIデバイスウェハの平坦化CMPに関する研究 : Cu-CMPにおける平坦化性能"}]},"item_type_id":"120","owner":"3","path":["634"],"pubdate":{"attribute_name":"公開日","attribute_value":"2009-06-02"},"publish_date":"2009-06-02","publish_status":"0","recid":"16622","relation_version_is_last":true,"title":["超LSIデバイスウェハの平坦化CMPに関する研究 : Cu-CMPにおける平坦化性能"],"weko_creator_id":"3","weko_shared_id":-1},"updated":"2023-05-15T18:15:42.698957+00:00"}