@article{oai:sucra.repo.nii.ac.jp:00016624,
 author = {服部, 博 and 土肥, 俊郎 and 木下, 将毅 and 玉川, 晃樹 and 加藤, 邦彦},
 journal = {埼玉大学地域共同研究センター紀要, Report of Cooperative Research Center, Saitama University},
 month = {},
 note = {This paper proposes the method of processing the surface of the electro-static chuck in a high accuracy. The electro-static chuck is applied as a device for the adsorption of wafers. To keep the homogeneity of temperature distribution, the surface should have a stable flatness. The uniform spreading of an adhesive was examined by using a spin-coater. As the results, the spin-coater uniformly spreads the adhesive, and the flatness on the surface
of the electro-static chuck has improved from 8i m to 44i m. Additionally, an inert gas should uniformly flow to all aspects of the wafer to optimize the temperature of the wafer. Authors proposed to install a minute ruggedness on the surface of electro-static chuck to form the stable gas route by lapping., text, application/pdf},
 pages = {69--72},
 title = {セラミック静電チャックに関する高精度加工プロセスとその基本特性},
 volume = {2},
 year = {2002}
}