{"created":"2023-05-15T15:27:43.664775+00:00","id":16648,"links":{},"metadata":{"_buckets":{"deposit":"ad623044-f14f-4368-9de1-08bb78367ec9"},"_deposit":{"created_by":3,"id":"16648","owners":[3],"pid":{"revision_id":0,"type":"depid","value":"16648"},"status":"published"},"_oai":{"id":"oai:sucra.repo.nii.ac.jp:00016648","sets":["95:239:635"]},"author_link":["27146","27144","27145","27143"],"item_120_alternative_title_1":{"attribute_name":"タイトル（別言語）","attribute_value_mlt":[{"subitem_alternative_title":"Study of a Semi-dry polishing method for oxide wafer CMP with Spiral type Fixed Ceria Abrasive Polishing Pad"}]},"item_120_biblio_info_8":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2003","bibliographicIssueDateType":"Issued"},"bibliographicPageEnd":"20","bibliographicPageStart":"14","bibliographicVolumeNumber":"3","bibliographic_titles":[{"bibliographic_title":"埼玉大学地域共同研究センター紀要"},{"bibliographic_title":"Report of Cooperative Research Center, Saitama University","bibliographic_titleLang":"en"}]}]},"item_120_date_31":{"attribute_name":"作成日","attribute_value_mlt":[{"subitem_date_issued_datetime":"2009-06-18","subitem_date_issued_type":"Created"}]},"item_120_description_19":{"attribute_name":"概要","attribute_value_mlt":[{"subitem_description":"Semi-dry polishing method for silicon oxide wafer CMP with Spiral type Fixed Ceria Abrasive polishing pad is proposed in this paper. High MRR of 400nm/min and high WIWNU of 8% are obtained by this method.\nSemi-dry pol ishing method is one of the method of slurry free CMP and is the new method using small amount of pure water instead of slurry and chemical liquid. Key technique of this method is how to control the amount of pure water on the pad surface before pol ishing. Control technique is examined, and polishing mechanism is discussed.","subitem_description_type":"Other"}]},"item_120_description_29":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"subitem_description":"text","subitem_description_type":"Other"}]},"item_120_description_30":{"attribute_name":"フォーマット","attribute_value_mlt":[{"subitem_description":"application/pdf","subitem_description_type":"Other"}]},"item_120_identifier_registration":{"attribute_name":"ID登録","attribute_value_mlt":[{"subitem_identifier_reg_text":"10.24561/00016642","subitem_identifier_reg_type":"JaLC"}]},"item_120_publisher_11":{"attribute_name":"出版者名","attribute_value_mlt":[{"subitem_publisher":"埼玉大学地域共同研究センター"}]},"item_120_source_id_14":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"13474758","subitem_source_identifier_type":"ISSN"}]},"item_120_text_3":{"attribute_name":"著者 ローマ字","attribute_value_mlt":[{"subitem_text_value":"Shirota, Wataru"},{"subitem_text_value":"Sakakibara, Susumu"},{"subitem_text_value":"Tominaga, Shigeru"},{"subitem_text_value":"Toshiroh Karari Doy"}]},"item_120_text_32":{"attribute_name":"アイテムID","attribute_value_mlt":[{"subitem_text_value":"KY-AA11808968-03-04"}]},"item_120_text_4":{"attribute_name":"著者 所属","attribute_value_mlt":[{"subitem_text_value":"株式会社ロキテクノ"},{"subitem_text_value":"株式会社ロキテクノ"},{"subitem_text_value":"株式会社ロキテクノ"},{"subitem_text_value":"埼玉大学教育学部"}]},"item_120_text_5":{"attribute_name":"著者 所属(別言語)","attribute_value_mlt":[{"subitem_text_value":"ROKITECHNO CO.,LTD"},{"subitem_text_value":"ROKITECHNO CO.,LTD"},{"subitem_text_value":"ROKITECHNO CO.,LTD"},{"subitem_text_value":"Faculty of Education, Saitama University"}]},"item_120_text_9":{"attribute_name":"年月次","attribute_value_mlt":[{"subitem_text_value":"2002"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"代田, 渉"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"榊原, 晋"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"富永, 茂"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"土肥, 俊郎"}],"nameIdentifiers":[{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2018-01-24"}],"displaytype":"detail","filename":"KY-AA11808968-03-04.pdf","filesize":[{"value":"468.7 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"KY-AA11808968-03-04.pdf","url":"https://sucra.repo.nii.ac.jp/record/16648/files/KY-AA11808968-03-04.pdf"},"version_id":"a331eca0-11a9-466c-b441-8009f7af60ad"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"departmental bulletin paper","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"新しい固定砥粒パッドによるのセミドライ加工方法の研究","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"新しい固定砥粒パッドによるのセミドライ加工方法の研究"}]},"item_type_id":"120","owner":"3","path":["635"],"pubdate":{"attribute_name":"公開日","attribute_value":"2009-05-21"},"publish_date":"2009-05-21","publish_status":"0","recid":"16648","relation_version_is_last":true,"title":["新しい固定砥粒パッドによるのセミドライ加工方法の研究"],"weko_creator_id":"3","weko_shared_id":-1},"updated":"2023-05-15T18:13:33.257912+00:00"}