{"created":"2023-05-15T15:27:43.707164+00:00","id":16649,"links":{},"metadata":{"_buckets":{"deposit":"6defa46c-4c52-485e-a774-b4a080ada90d"},"_deposit":{"created_by":3,"id":"16649","owners":[3],"pid":{"revision_id":0,"type":"depid","value":"16649"},"status":"published"},"_oai":{"id":"oai:sucra.repo.nii.ac.jp:00016649","sets":["95:239:635"]},"author_link":["27148","28731","28730","27147","28729"],"item_120_biblio_info_8":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2003","bibliographicIssueDateType":"Issued"},"bibliographicPageEnd":"24","bibliographicPageStart":"21","bibliographicVolumeNumber":"3","bibliographic_titles":[{"bibliographic_title":"埼玉大学地域共同研究センター紀要"},{"bibliographic_title":"Report of Cooperative Research Center, Saitama University","bibliographic_titleLang":"en"}]}]},"item_120_date_31":{"attribute_name":"作成日","attribute_value_mlt":[{"subitem_date_issued_datetime":"2009-06-18","subitem_date_issued_type":"Created"}]},"item_120_description_19":{"attribute_name":"概要","attribute_value_mlt":[{"subitem_description":"ceria(CeO2) slurry has a strong merit in CMP polishing to give a high removal rate and is more and more used. Polishing efficiency such as removal rate must depend essentially on intrinsic properties ofSi02powder .In the present study we investigated the polishing properties and sbmy stability 00 new powders which have been tuned at during synthesis to increase their polishing efficiency. We investigated those properties in the range of pH of 3 to 10 and compared performances to commercial slwries. We could get with the best powder a removal rate 1.5times superior to ceria commercial sluny and 8 times higher than silica commercial sluny. However those 3 powders proved not to have so good sedimentation stability at pH of 7. This should be solved by tuning the formulation by addition of appropriate surfactant","subitem_description_type":"Other"}]},"item_120_description_29":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"subitem_description":"text","subitem_description_type":"Other"}]},"item_120_description_30":{"attribute_name":"フォーマット","attribute_value_mlt":[{"subitem_description":"application/pdf","subitem_description_type":"Other"}]},"item_120_identifier_registration":{"attribute_name":"ID登録","attribute_value_mlt":[{"subitem_identifier_reg_text":"10.24561/00016643","subitem_identifier_reg_type":"JaLC"}]},"item_120_publisher_11":{"attribute_name":"出版者名","attribute_value_mlt":[{"subitem_publisher":"埼玉大学地域共同研究センター"}]},"item_120_source_id_14":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"13474758","subitem_source_identifier_type":"ISSN"}]},"item_120_text_3":{"attribute_name":"著者 ローマ字","attribute_value_mlt":[{"subitem_text_value":"B. PACAUD"},{"subitem_text_value":"T. K. DOY"},{"subitem_text_value":"Y. UEKI"},{"subitem_text_value":"Y. SASAKAWA"},{"subitem_text_value":"E. ROHART"}]},"item_120_text_32":{"attribute_name":"アイテムID","attribute_value_mlt":[{"subitem_text_value":"KY-AA11808968-03-05"}]},"item_120_text_4":{"attribute_name":"著者 所属","attribute_value_mlt":[{"subitem_text_value":"Rhodia Electronics & Catalysis"},{"subitem_text_value":"Saitama University"},{"subitem_text_value":"Saitama University"},{"subitem_text_value":"Saitama University"},{"subitem_text_value":"Rhodia Electronics & Catalysis"}]},"item_120_text_9":{"attribute_name":"年月次","attribute_value_mlt":[{"subitem_text_value":"2002"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"PACAUD, PACAUDB."}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"土肥, 俊郎"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"UEKI, Y."}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"SASAKAWA, Y."}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"ROHART, E."}],"nameIdentifiers":[{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2018-01-24"}],"displaytype":"detail","filename":"KY-AA11808968-03-05.pdf","filesize":[{"value":"207.9 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"KY-AA11808968-03-05.pdf","url":"https://sucra.repo.nii.ac.jp/record/16649/files/KY-AA11808968-03-05.pdf"},"version_id":"3c5a81f7-2e27-4f84-aead-54ee248aa10c"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"CMP","subitem_subject_scheme":"Other"},{"subitem_subject":"Ceria slurry","subitem_subject_scheme":"Other"},{"subitem_subject":"Removal rate","subitem_subject_scheme":"Other"},{"subitem_subject":"Surface roughness","subitem_subject_scheme":"Other"},{"subitem_subject":"Zeta potential","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"departmental bulletin paper","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"NEW CERIUM POWDERS FOR OXIDE FILM PLANARIZATION-CMP","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"NEW CERIUM POWDERS FOR OXIDE FILM PLANARIZATION-CMP"}]},"item_type_id":"120","owner":"3","path":["635"],"pubdate":{"attribute_name":"公開日","attribute_value":"2009-05-21"},"publish_date":"2009-05-21","publish_status":"0","recid":"16649","relation_version_is_last":true,"title":["NEW CERIUM POWDERS FOR OXIDE FILM PLANARIZATION-CMP"],"weko_creator_id":"3","weko_shared_id":3},"updated":"2023-05-15T18:13:35.379588+00:00"}