@article{oai:sucra.repo.nii.ac.jp:00016650,
 author = {田辺, 克行 and 土肥, 俊郎},
 journal = {埼玉大学地域共同研究センター紀要, Report of Cooperative Research Center, Saitama University},
 month = {},
 note = {The new type Polishing Pad for CMP is composed two materials which are fibers and non-foamed polyurethane. Fibers are perpendicular to the face ofthe polishing pad.
A new pad shows higher removal rate of Si02 filmformed over silicon wafer than conventional pad, but the effects of fibers are unkown. We will manufacture pads thar contain various fibers or increase quantities of fibers,and exmamine effects of fiber for CMP., text, application/pdf},
 pages = {25--28},
 title = {繊維/ウレタン樹脂複合型研磨パッドの試作と加工特性},
 volume = {3},
 year = {2003}
}