{"created":"2023-05-15T15:27:43.749132+00:00","id":16650,"links":{},"metadata":{"_buckets":{"deposit":"9d732f46-8ab7-4141-8820-bf24d52e7d06"},"_deposit":{"created_by":3,"id":"16650","owners":[3],"pid":{"revision_id":0,"type":"depid","value":"16650"},"status":"published"},"_oai":{"id":"oai:sucra.repo.nii.ac.jp:00016650","sets":["95:239:635"]},"author_link":["27150","27149"],"item_120_alternative_title_1":{"attribute_name":"タイトル（別言語）","attribute_value_mlt":[{"subitem_alternative_title":"A Trial Product and Its Processing Characteristic of the Polishing Pad Using FiberComposited polyurethan"}]},"item_120_biblio_info_8":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2003","bibliographicIssueDateType":"Issued"},"bibliographicPageEnd":"28","bibliographicPageStart":"25","bibliographicVolumeNumber":"3","bibliographic_titles":[{"bibliographic_title":"埼玉大学地域共同研究センター紀要"},{"bibliographic_title":"Report of Cooperative Research Center, Saitama University","bibliographic_titleLang":"en"}]}]},"item_120_date_31":{"attribute_name":"作成日","attribute_value_mlt":[{"subitem_date_issued_datetime":"2009-06-18","subitem_date_issued_type":"Created"}]},"item_120_description_19":{"attribute_name":"概要","attribute_value_mlt":[{"subitem_description":"The new type Polishing Pad for CMP is composed two materials which are fibers and non-foamed polyurethane. Fibers are perpendicular to the face ofthe polishing pad.\nA new pad shows higher removal rate of Si02 filmformed over silicon wafer than conventional pad, but the effects of fibers are unkown. We will manufacture pads thar contain various fibers or increase quantities of fibers,and exmamine effects of fiber for CMP.","subitem_description_type":"Other"}]},"item_120_description_29":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"subitem_description":"text","subitem_description_type":"Other"}]},"item_120_description_30":{"attribute_name":"フォーマット","attribute_value_mlt":[{"subitem_description":"application/pdf","subitem_description_type":"Other"}]},"item_120_identifier_registration":{"attribute_name":"ID登録","attribute_value_mlt":[{"subitem_identifier_reg_text":"10.24561/00016644","subitem_identifier_reg_type":"JaLC"}]},"item_120_publisher_11":{"attribute_name":"出版者名","attribute_value_mlt":[{"subitem_publisher":"埼玉大学地域共同研究センター"}]},"item_120_source_id_14":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"13474758","subitem_source_identifier_type":"ISSN"}]},"item_120_text_3":{"attribute_name":"著者 ローマ字","attribute_value_mlt":[{"subitem_text_value":"Tanabe, Katsuyuki"},{"subitem_text_value":"Toshiroh K. Doy"}]},"item_120_text_32":{"attribute_name":"アイテムID","attribute_value_mlt":[{"subitem_text_value":"KY-AA11808968-03-06"}]},"item_120_text_4":{"attribute_name":"著者 所属","attribute_value_mlt":[{"subitem_text_value":"ユニチカ株式会社中央研究所"},{"subitem_text_value":"埼玉大学教育学部"}]},"item_120_text_5":{"attribute_name":"著者 所属(別言語)","attribute_value_mlt":[{"subitem_text_value":"UNITIKA LTD"},{"subitem_text_value":"Faculty of Education, Saitama University"}]},"item_120_text_9":{"attribute_name":"年月次","attribute_value_mlt":[{"subitem_text_value":"2002"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"田辺, 克行"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"土肥, 俊郎"}],"nameIdentifiers":[{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2018-01-24"}],"displaytype":"detail","filename":"KY-AA11808968-03-06.pdf","filesize":[{"value":"178.5 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"KY-AA11808968-03-06.pdf","url":"https://sucra.repo.nii.ac.jp/record/16650/files/KY-AA11808968-03-06.pdf"},"version_id":"c8ae5cf5-bc3f-4918-992b-4500ed03e12e"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"CMP","subitem_subject_scheme":"Other"},{"subitem_subject":"Polishing Pad","subitem_subject_scheme":"Other"},{"subitem_subject":"Fiber","subitem_subject_scheme":"Other"},{"subitem_subject":"ILD","subitem_subject_scheme":"Other"},{"subitem_subject":"Removal Rate","subitem_subject_scheme":"Other"},{"subitem_subject":"Surface Roughness","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"departmental bulletin paper","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"繊維/ウレタン樹脂複合型研磨パッドの試作と加工特性","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"繊維/ウレタン樹脂複合型研磨パッドの試作と加工特性"}]},"item_type_id":"120","owner":"3","path":["635"],"pubdate":{"attribute_name":"公開日","attribute_value":"2009-05-21"},"publish_date":"2009-05-21","publish_status":"0","recid":"16650","relation_version_is_last":true,"title":["繊維/ウレタン樹脂複合型研磨パッドの試作と加工特性"],"weko_creator_id":"3","weko_shared_id":-1},"updated":"2023-05-15T18:13:37.783310+00:00"}