@article{oai:sucra.repo.nii.ac.jp:00016688,
 author = {堀口, 文江 and 土肥, 俊郎 and 堀本, 卓 and 鈴木, 辰俊 and 瀬山, 貴司 and 船越, 考雄},
 journal = {埼玉大学地域共同研究センター紀要, Report of Cooperative Research Center, Saitama Univerity},
 month = {},
 note = {In CMP (Chemical Mechanical Polishing) characteristics, the shapes of grooves formed on pad surface affect greatly on removal rate, non-uniformity within wafer surface and slurry flow rate. They allow the slurry flow toward the center or outside of the pad when the pad is rotating. In this study, how 7 different slanted grooves on the pad surface affect the removal rate and slurry flow rate were examined. As a result, different and unique characteristics were observed. These slanted groove pads may make it possible to improve polishing performances such as removal rate and reducing the amount of slurry to be used., text, application/pdf},
 pages = {1--4},
 title = {CMP特性に及ぼすパッド溝断面の傾斜角の影響},
 volume = {4},
 year = {2004},
 yomi = {ホリグチ, フミエ and ドイ, トシロウ and ホリモト, スグル and スズキ, タツトシ and セヤマ, タカシ and フナコシ, タカオ}
}