@article{oai:sucra.repo.nii.ac.jp:00016691,
 author = {ベルナール, ・パコ and 土肥, 俊郎 and 植木, 由佳子 and エマニエル, ・ロアート},
 journal = {埼玉大学地域共同研究センター紀要, Report of Cooperative Research Center, Saitama Univerity},
 month = {},
 note = {In this study, ceria slurries (CeOz) for oxide fIlms are applied for planarization CMP for high performance and high-grade polishing. The investigation on ceria slurry focused on calcination temperature was carried out. Polishing characteristics of oxide mms to disperse ceria particles, which is necessary to make ceria slurry work efficiently, were found. The results indicate that the dispersibility and the removal rate of ceria slurry are affected by pH and the additive rate, and in particular, the removal rate is on the decrease especially by adding the additives., text, application/pdf},
 pages = {14--17},
 title = {セリアスラリーによる酸化膜の平坦化CMPに関する基礎的検討},
 volume = {4},
 year = {2004}
}