{"created":"2023-05-15T15:27:47.120384+00:00","id":16730,"links":{},"metadata":{"_buckets":{"deposit":"5a6d5e98-2286-4a65-934e-f0aa79b8d010"},"_deposit":{"created_by":3,"id":"16730","owners":[3],"pid":{"revision_id":0,"type":"depid","value":"16730"},"status":"published"},"_oai":{"id":"oai:sucra.repo.nii.ac.jp:00016730","sets":["95:239:637"]},"author_link":["27362","27361"],"item_120_alternative_title_1":{"attribute_name":"タイトル（別言語）","attribute_value_mlt":[{"subitem_alternative_title":"Study of Electro-Chemical polishing method for Cu Wiring"}]},"item_120_biblio_info_8":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2005","bibliographicIssueDateType":"Issued"},"bibliographicPageEnd":"10","bibliographicPageStart":"7","bibliographicVolumeNumber":"5","bibliographic_titles":[{"bibliographic_title":"埼玉大学地域共同研究センター紀要"},{"bibliographic_title":"Report of Cooperative Research Center, Saitama University","bibliographic_titleLang":"en"}]}]},"item_120_date_31":{"attribute_name":"作成日","attribute_value_mlt":[{"subitem_date_issued_datetime":"2009-06-17","subitem_date_issued_type":"Created"}]},"item_120_description_19":{"attribute_name":"概要","attribute_value_mlt":[{"subitem_description":"Cu/Low-kデュアルダマシン配線形成プロセスにおけるCu配線膜研磨において、超低圧研磨条件で高い加工能率を得ることを目的とした新しい電気化学的研磨方法を検討した。本方法は導電性表層と絶縁層を有する多層構造の電解セルパッドをプラテン・ロータリー型ポリシング装置に適用したもので、リン酸水溶液、硫酸銅水溶液及びクエン酸水溶液を電解液に使用し、走電流電解によるCu配線膜の加工特性を測定した。リン酸水溶液を電解液とした場合、高い研磨レートが得られたが、エッチング量が大きく、研磨面の表面粗さも過大であったが、クエン酸水溶液との混合電解液とした場合、エッチング量、表面粗さともに改善できることを示した。また、BTAを電解液に添加することで、段差解消性の改善ができることを示した。","subitem_description_type":"Other"}]},"item_120_description_29":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"subitem_description":"text","subitem_description_type":"Other"}]},"item_120_description_30":{"attribute_name":"フォーマット","attribute_value_mlt":[{"subitem_description":"application/pdf","subitem_description_type":"Other"}]},"item_120_identifier_registration":{"attribute_name":"ID登録","attribute_value_mlt":[{"subitem_identifier_reg_text":"10.24561/00016724","subitem_identifier_reg_type":"JaLC"}]},"item_120_publisher_11":{"attribute_name":"出版者名","attribute_value_mlt":[{"subitem_publisher":"埼玉大学地域共同研究センター"}]},"item_120_publisher_12":{"attribute_name":"出版者名（別言語）","attribute_value_mlt":[{"subitem_publisher":"Cooperative Research Center, Saitama University"}]},"item_120_source_id_14":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"13474758","subitem_source_identifier_type":"ISSN"}]},"item_120_text_3":{"attribute_name":"著者 ローマ字","attribute_value_mlt":[{"subitem_text_value":"Tominaga, Shigeru"},{"subitem_text_value":"Doi, Toshiroh"}]},"item_120_text_32":{"attribute_name":"アイテムID","attribute_value_mlt":[{"subitem_text_value":"KY-AA11808968-05-03"}]},"item_120_text_4":{"attribute_name":"著者 所属","attribute_value_mlt":[{"subitem_text_value":"株式会社ロキテクノ"},{"subitem_text_value":"埼玉大学教育学部"}]},"item_120_text_5":{"attribute_name":"著者 所属(別言語)","attribute_value_mlt":[{"subitem_text_value":"ROKITECHNO CO., LTD"},{"subitem_text_value":"Faculty of Education, Saitama University"}]},"item_120_text_9":{"attribute_name":"年月次","attribute_value_mlt":[{"subitem_text_value":"2004"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"富永, 茂"},{"creatorName":"トミナガ, シゲル","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"土肥, 俊郎"},{"creatorName":"ドイ, トシロウ","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2018-01-24"}],"displaytype":"detail","filename":"KY-AA11808968-05-03.pdf","filesize":[{"value":"231.4 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"KY-AA11808968-05-03.pdf","url":"https://sucra.repo.nii.ac.jp/record/16730/files/KY-AA11808968-05-03.pdf"},"version_id":"b15d1e84-036b-406e-8a1f-fd40b034b088"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"departmental bulletin paper","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"Cu配線材の電気化学的ポリシング法の基礎的研究(2)","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Cu配線材の電気化学的ポリシング法の基礎的研究(2)"}]},"item_type_id":"120","owner":"3","path":["637"],"pubdate":{"attribute_name":"公開日","attribute_value":"2009-05-01"},"publish_date":"2009-05-01","publish_status":"0","recid":"16730","relation_version_is_last":true,"title":["Cu配線材の電気化学的ポリシング法の基礎的研究(2)"],"weko_creator_id":"3","weko_shared_id":-1},"updated":"2023-05-15T18:10:44.880492+00:00"}