{"created":"2023-05-15T15:27:47.162932+00:00","id":16731,"links":{},"metadata":{"_buckets":{"deposit":"2d13846c-a214-4945-a184-bb8fa6859283"},"_deposit":{"created_by":3,"id":"16731","owners":[3],"pid":{"revision_id":0,"type":"depid","value":"16731"},"status":"published"},"_oai":{"id":"oai:sucra.repo.nii.ac.jp:00016731","sets":["95:239:637"]},"author_link":["27363","27366","27365","27367","27364"],"item_120_alternative_title_1":{"attribute_name":"タイトル（別言語）","attribute_value_mlt":[{"subitem_alternative_title":"Evaluation of Tungsten CMP by using Optimized Recovery Slurry"}]},"item_120_biblio_info_8":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2005","bibliographicIssueDateType":"Issued"},"bibliographicPageEnd":"17","bibliographicPageStart":"13","bibliographicVolumeNumber":"5","bibliographic_titles":[{"bibliographic_title":"埼玉大学地域共同研究センター紀要"},{"bibliographic_title":"Report of Cooperative Research Center, Saitama University","bibliographic_titleLang":"en"}]}]},"item_120_date_31":{"attribute_name":"作成日","attribute_value_mlt":[{"subitem_date_issued_datetime":"2009-06-17","subitem_date_issued_type":"Created"}]},"item_120_description_19":{"attribute_name":"概要","attribute_value_mlt":[{"subitem_description":"Chemical Mechanical Polishing (CMP) is essential for the manufacturing of recent high-performance electronic device. However, for the CMP process, huge amount of slurry is used, which is to be disposed after being used only once. From the viewpoint of reduction of environmental burdens, this study was made for exploring the possibility of recycling of slurry by focusing on the slurry used for Tungsten CMP. For that purpose, we recovered the slurry used for polishing and then tried to reuse it for polishing again. As a method for evaluation, we made comparisons of removal rates between new slurry and recovered slurry. The results shows that when recovering the slurry during CMP, it contained the water remained on the surface of the polishing pad after dressing, by which slurry was diluted and caused the reduction of removal rate of Tungsten film. However, it was found that when making polishing of Tungsten film using the slurry recovered without being diluted with water, the same level of removal rate as new slurry is obtained.","subitem_description_type":"Other"}]},"item_120_description_29":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"subitem_description":"text","subitem_description_type":"Other"}]},"item_120_description_30":{"attribute_name":"フォーマット","attribute_value_mlt":[{"subitem_description":"application/pdf","subitem_description_type":"Other"}]},"item_120_identifier_registration":{"attribute_name":"ID登録","attribute_value_mlt":[{"subitem_identifier_reg_text":"10.24561/00016725","subitem_identifier_reg_type":"JaLC"}]},"item_120_publisher_11":{"attribute_name":"出版者名","attribute_value_mlt":[{"subitem_publisher":"埼玉大学地域共同研究センター"}]},"item_120_publisher_12":{"attribute_name":"出版者名（別言語）","attribute_value_mlt":[{"subitem_publisher":"Cooperative Research Center, Saitama University"}]},"item_120_source_id_14":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"13474758","subitem_source_identifier_type":"ISSN"}]},"item_120_text_3":{"attribute_name":"著者 ローマ字","attribute_value_mlt":[{"subitem_text_value":"Ojima, Senri"},{"subitem_text_value":"Funakohi, ,Takao"},{"subitem_text_value":"Hori, Toru"},{"subitem_text_value":"Abe, Mitsugu"},{"subitem_text_value":"Doi, Toshiro"}]},"item_120_text_32":{"attribute_name":"アイテムID","attribute_value_mlt":[{"subitem_text_value":"KY-AA11808968-05-04"}]},"item_120_text_4":{"attribute_name":"著者 所属","attribute_value_mlt":[{"subitem_text_value":"野村マイクロ・サイエンス株式会社"},{"subitem_text_value":"埼玉大学教育学部"},{"subitem_text_value":"野村マイクロ・サイエンス株式会社"},{"subitem_text_value":"野村マイクロ・サイエンス株式会社"},{"subitem_text_value":"埼玉大学教育学部"}]},"item_120_text_5":{"attribute_name":"著者 所属(別言語)","attribute_value_mlt":[{"subitem_text_value":"Functional Product Div. Development Headquarters Nomura Micro Science Co., Ltd."},{"subitem_text_value":"Department of Education Saitama University"},{"subitem_text_value":"Functional Product Div. Development Headquarters Nomura Micro Science Co., Ltd."},{"subitem_text_value":"Functional Product Div. Development Headquarters Nomura Micro Science Co., Ltd."},{"subitem_text_value":"Department of Education Saitama University"}]},"item_120_text_9":{"attribute_name":"年月次","attribute_value_mlt":[{"subitem_text_value":"2004"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"小島, 泉里"},{"creatorName":"オジマ, センリ","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"船越, 考雄"},{"creatorName":"フナコシ, タカオ","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"堀, 徹"},{"creatorName":"ホリ, トオル","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"阿部, 嗣"},{"creatorName":"アベ, ミツグ","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"土肥, 俊郎"},{"creatorName":"ドイ, トシロウ","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2018-01-24"}],"displaytype":"detail","filename":"KY-AA11808968-05-04.pdf","filesize":[{"value":"231.3 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"KY-AA11808968-05-04.pdf","url":"https://sucra.repo.nii.ac.jp/record/16731/files/KY-AA11808968-05-04.pdf"},"version_id":"db17ced7-e1cb-4d82-80f1-442df7850f2a"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"Tungsten(W)-CMP","subitem_subject_scheme":"Other"},{"subitem_subject":"Slurry","subitem_subject_scheme":"Other"},{"subitem_subject":"Recycling","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"departmental bulletin paper","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"最適に回収されたスラリーを用いたタングステンCMPの評価","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"最適に回収されたスラリーを用いたタングステンCMPの評価"}]},"item_type_id":"120","owner":"3","path":["637"],"pubdate":{"attribute_name":"公開日","attribute_value":"2009-05-01"},"publish_date":"2009-05-01","publish_status":"0","recid":"16731","relation_version_is_last":true,"title":["最適に回収されたスラリーを用いたタングステンCMPの評価"],"weko_creator_id":"3","weko_shared_id":-1},"updated":"2023-05-15T18:10:47.800549+00:00"}