@article{oai:sucra.repo.nii.ac.jp:00016732,
 author = {藤田, 隆 and 土肥, 俊郎 and 上川, 大地},
 journal = {埼玉大学地域共同研究センター紀要, Report of Cooperative Research Center, Saitama University},
 month = {},
 note = {The various pad surface treatments were evaluated to clarify dominant factors on a pad surface to get removal rate on CMP(Chemical Mechanical Polishing). On evaluating the dominant surface' factors, pad surface recovery without grinding removal of pad surface was tried using a no-conditioning pad. After eliminating the by-products involved in the pad surface, recovery ratio on removal rate became 31% at most, which indicated that the by-products clogging in the pad surface was not a dominant factor to inhibit removal rate. Not grinding the surface but scraping the surface was valid for effective surface recovery to get removal rate. In this study, a noble pad conditioner was proposed from their results. The developed conditioner, which is the scraping brush conditioner, makes use of deflective deformation in order to apply constant contact force against height variation of pad surface. Consequently, it was demonstrated that the developed conditioner was applicable on surface reference conditioning on CMP without the stick-slip motion that occurs on the traditional conditioner., text, application/pdf},
 pages = {19--26},
 title = {平坦化CMPにおけるパッドドレッシングに関する研究},
 volume = {5},
 year = {2005},
 yomi = {フジタ, タカシ and ドイ, トシロウ and カミカワ, ダイチ}
}