{"created":"2023-05-15T15:27:47.205265+00:00","id":16732,"links":{},"metadata":{"_buckets":{"deposit":"b9884978-7918-40ed-9666-9d11b64356b2"},"_deposit":{"created_by":3,"id":"16732","owners":[3],"pid":{"revision_id":0,"type":"depid","value":"16732"},"status":"published"},"_oai":{"id":"oai:sucra.repo.nii.ac.jp:00016732","sets":["95:239:637"]},"author_link":["27368","27369","27370"],"item_120_alternative_title_1":{"attribute_name":"タイトル（別言語）","attribute_value_mlt":[{"subitem_alternative_title":"Study on fundamental pad conditioning mechanism for Chemical Mechanical Polishing"}]},"item_120_biblio_info_8":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2005","bibliographicIssueDateType":"Issued"},"bibliographicPageEnd":"26","bibliographicPageStart":"19","bibliographicVolumeNumber":"5","bibliographic_titles":[{"bibliographic_title":"埼玉大学地域共同研究センター紀要"},{"bibliographic_title":"Report of Cooperative Research Center, Saitama University","bibliographic_titleLang":"en"}]}]},"item_120_date_31":{"attribute_name":"作成日","attribute_value_mlt":[{"subitem_date_issued_datetime":"2009-06-17","subitem_date_issued_type":"Created"}]},"item_120_description_19":{"attribute_name":"概要","attribute_value_mlt":[{"subitem_description":"The various pad surface treatments were evaluated to clarify dominant factors on a pad surface to get removal rate on CMP(Chemical Mechanical Polishing). On evaluating the dominant surface' factors, pad surface recovery without grinding removal of pad surface was tried using a no-conditioning pad. After eliminating the by-products involved in the pad surface, recovery ratio on removal rate became 31% at most, which indicated that the by-products clogging in the pad surface was not a dominant factor to inhibit removal rate. Not grinding the surface but scraping the surface was valid for effective surface recovery to get removal rate. In this study, a noble pad conditioner was proposed from their results. The developed conditioner, which is the scraping brush conditioner, makes use of deflective deformation in order to apply constant contact force against height variation of pad surface. Consequently, it was demonstrated that the developed conditioner was applicable on surface reference conditioning on CMP without the stick-slip motion that occurs on the traditional conditioner.","subitem_description_type":"Other"}]},"item_120_description_29":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"subitem_description":"text","subitem_description_type":"Other"}]},"item_120_description_30":{"attribute_name":"フォーマット","attribute_value_mlt":[{"subitem_description":"application/pdf","subitem_description_type":"Other"}]},"item_120_identifier_registration":{"attribute_name":"ID登録","attribute_value_mlt":[{"subitem_identifier_reg_text":"10.24561/00016726","subitem_identifier_reg_type":"JaLC"}]},"item_120_publisher_11":{"attribute_name":"出版者名","attribute_value_mlt":[{"subitem_publisher":"埼玉大学地域共同研究センター"}]},"item_120_publisher_12":{"attribute_name":"出版者名（別言語）","attribute_value_mlt":[{"subitem_publisher":"Cooperative Research Center, Saitama University"}]},"item_120_source_id_14":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"13474758","subitem_source_identifier_type":"ISSN"}]},"item_120_text_3":{"attribute_name":"著者 ローマ字","attribute_value_mlt":[{"subitem_text_value":"Fujita, Takashi"},{"subitem_text_value":"Doi, Tashiro"},{"subitem_text_value":"Kamikawa, Daichi"}]},"item_120_text_32":{"attribute_name":"アイテムID","attribute_value_mlt":[{"subitem_text_value":"KY-AA11808968-05-05"}]},"item_120_text_4":{"attribute_name":"著者 所属","attribute_value_mlt":[{"subitem_text_value":"株式会社東京精密"},{"subitem_text_value":"埼玉大学教育学部"},{"subitem_text_value":"芝浦工業大学"}]},"item_120_text_5":{"attribute_name":"著者 所属(別言語)","attribute_value_mlt":[{"subitem_text_value":"Tokyo Seimitsu Co.Ltd"},{"subitem_text_value":"Faculty of Education, Saitama University"},{"subitem_text_value":"Shibaura Institute of Technology"}]},"item_120_text_9":{"attribute_name":"年月次","attribute_value_mlt":[{"subitem_text_value":"2004"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"藤田, 隆"},{"creatorName":"フジタ, タカシ","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"土肥, 俊郎"},{"creatorName":"ドイ, トシロウ","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"上川, 大地"},{"creatorName":"カミカワ, ダイチ","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2018-01-24"}],"displaytype":"detail","filename":"KY-AA11808968-05-05.pdf","filesize":[{"value":"504.8 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"KY-AA11808968-05-05.pdf","url":"https://sucra.repo.nii.ac.jp/record/16732/files/KY-AA11808968-05-05.pdf"},"version_id":"a10f870d-5ab2-457c-88c9-b9da8af9cf72"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"pad conditioning","subitem_subject_scheme":"Other"},{"subitem_subject":"CMP","subitem_subject_scheme":"Other"},{"subitem_subject":"surface treatment","subitem_subject_scheme":"Other"},{"subitem_subject":"surface reference conditioning","subitem_subject_scheme":"Other"},{"subitem_subject":"removal rate recovery","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"departmental bulletin paper","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"平坦化CMPにおけるパッドドレッシングに関する研究","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"平坦化CMPにおけるパッドドレッシングに関する研究"}]},"item_type_id":"120","owner":"3","path":["637"],"pubdate":{"attribute_name":"公開日","attribute_value":"2009-05-01"},"publish_date":"2009-05-01","publish_status":"0","recid":"16732","relation_version_is_last":true,"title":["平坦化CMPにおけるパッドドレッシングに関する研究"],"weko_creator_id":"3","weko_shared_id":-1},"updated":"2023-05-15T18:10:48.617359+00:00"}