{"created":"2023-05-15T15:27:49.572126+00:00","id":16788,"links":{},"metadata":{"_buckets":{"deposit":"14152b6c-cd13-476d-8189-c5ea9a3ee89c"},"_deposit":{"created_by":3,"id":"16788","owners":[3],"pid":{"revision_id":0,"type":"depid","value":"16788"},"status":"published"},"_oai":{"id":"oai:sucra.repo.nii.ac.jp:00016788","sets":["95:239:639"]},"author_link":["27530","27532","27531"],"item_120_alternative_title_1":{"attribute_name":"タイトル（別言語）","attribute_value_mlt":[{"subitem_alternative_title":"CMP Pad Conditioning Technique using a High Pressure Micro Jet"}]},"item_120_biblio_info_8":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2007","bibliographicIssueDateType":"Issued"},"bibliographicPageEnd":"19","bibliographicPageStart":"14","bibliographicVolumeNumber":"7","bibliographic_titles":[{"bibliographic_title":"埼玉大学地域共同研究センター紀要"},{"bibliographic_title":"Report of Cooperative Research Center, Saitama University","bibliographic_titleLang":"en"}]}]},"item_120_date_31":{"attribute_name":"作成日","attribute_value_mlt":[{"subitem_date_issued_datetime":"2009-03-02","subitem_date_issued_type":"Created"}]},"item_120_description_19":{"attribute_name":"概要","attribute_value_mlt":[{"subitem_description":"Conventional diamond disc pad conditioning methods employed in chemical mechanical planarization (CMP) have presented several problems for integrated circuit (IC) manufacturers. These include diamond wear, which reduces pad life, and diamond fracture, which causes the semiconductor devices to be scratched by loose diamond fragments. In order to attempt to overcome these problems, a high-pressure micro jet (HPMJ) conditioning system, in which pressurized ultra pure water (UPW) ranging from 3 - 20 MPa is sprayed on the pad surface, is proposed and developed. In this study, it is demonstrated that the HPMJ can adapt the pad conditioning of device CMP and silicon CMP for the experiments.","subitem_description_type":"Other"}]},"item_120_description_29":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"subitem_description":"text","subitem_description_type":"Other"}]},"item_120_description_30":{"attribute_name":"フォーマット","attribute_value_mlt":[{"subitem_description":"application/pdf","subitem_description_type":"Other"}]},"item_120_identifier_registration":{"attribute_name":"ID登録","attribute_value_mlt":[{"subitem_identifier_reg_text":"10.24561/00016782","subitem_identifier_reg_type":"JaLC"}]},"item_120_publisher_11":{"attribute_name":"出版者名","attribute_value_mlt":[{"subitem_publisher":"埼玉大学総合研究機構地域共同研究センター産学連携推進部門"}]},"item_120_source_id_14":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"13474758","subitem_source_identifier_type":"ISSN"}]},"item_120_text_3":{"attribute_name":"著者 ローマ字","attribute_value_mlt":[{"subitem_text_value":"Miyachi, Keiji"},{"subitem_text_value":"Seike, Yoshiyuki"},{"subitem_text_value":"Doi, Toshiro"}]},"item_120_text_32":{"attribute_name":"アイテムID","attribute_value_mlt":[{"subitem_text_value":"KY-AA11808968-07-05"}]},"item_120_text_4":{"attribute_name":"著者 所属","attribute_value_mlt":[{"subitem_text_value":"旭サナック株式会社NC事業部"},{"subitem_text_value":"旭サナック株式会社NC事業部"},{"subitem_text_value":"埼玉大学教育学部(現九州大学大学院工学研究院知能機械システム部門)"}]},"item_120_text_5":{"attribute_name":"著者 所属(別言語)","attribute_value_mlt":[{"subitem_text_value":"Asahi Sunac Corporation NC division"},{"subitem_text_value":"Asahi Sunac Corporation NC division"},{"subitem_text_value":"The Faculty of Education, Saitama University (Department of Intelligent Machinery & Systems Faculty of Engineering , Kyushu University)"}]},"item_120_text_9":{"attribute_name":"年月次","attribute_value_mlt":[{"subitem_text_value":"2006"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"宮地, 計二"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"清家, 善之"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"土肥, 俊郎"}],"nameIdentifiers":[{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2018-01-24"}],"displaytype":"detail","filename":"KY-AA11808968-07-05.pdf","filesize":[{"value":"722.0 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"KY-AA11808968-07-05.pdf","url":"https://sucra.repo.nii.ac.jp/record/16788/files/KY-AA11808968-07-05.pdf"},"version_id":"1146e6a2-c46d-4dcb-8513-f8074fb26474"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"Chemical Mechanical Polishing (CMP)","subitem_subject_scheme":"Other"},{"subitem_subject":"High pressure Micro Jet (HPMJ)","subitem_subject_scheme":"Other"},{"subitem_subject":"Pad Conditioning","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"departmental bulletin paper","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"高圧マイクロジェットを用いたCMPパッドコンディショニング技術","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"高圧マイクロジェットを用いたCMPパッドコンディショニング技術"}]},"item_type_id":"120","owner":"3","path":["639"],"pubdate":{"attribute_name":"公開日","attribute_value":"2009-03-03"},"publish_date":"2009-03-03","publish_status":"0","recid":"16788","relation_version_is_last":true,"title":["高圧マイクロジェットを用いたCMPパッドコンディショニング技術"],"weko_creator_id":"3","weko_shared_id":3},"updated":"2023-05-15T18:08:41.797962+00:00"}