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セリアスラリーによる酸化膜の平坦化CMPに関する基礎的検討
https://doi.org/10.24561/00016607
https://doi.org/10.24561/00016607a529c4bd-d8ff-4aed-a775-122afe11ec79
名前 / ファイル | ライセンス | アクション |
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KY-AA11808968-02-06.pdf (331.2 kB)
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Item type | 紀要論文 / Departmental Bulletin Paper(1) | |||||
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公開日 | 2009-06-02 | |||||
タイトル | ||||||
タイトル | セリアスラリーによる酸化膜の平坦化CMPに関する基礎的検討 | |||||
言語 | ||||||
言語 | eng | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | CMP | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Ceria slurry | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Ultra sonic treatment | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Removal rate | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Surface roughness | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Zeta potential | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Stability | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Concentration | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
資源タイプ | departmental bulletin paper | |||||
ID登録 | ||||||
ID登録 | 10.24561/00016607 | |||||
ID登録タイプ | JaLC | |||||
タイトル(別言語) | ||||||
その他のタイトル | BASIC STUDYOF OXIDE FILM PLANARIZATION-CMP WITH CERIA SLURRY | |||||
著者 |
ベルナール, ・パコ
× ベルナール, ・パコ× 土肥, 俊郎× 笹川, 有紀× ロアート・, エマニエル |
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著者 ローマ字 | ||||||
B. PACAUD | ||||||
著者 ローマ字 | ||||||
T. K. DOY | ||||||
著者 ローマ字 | ||||||
Y.SASAKAWA | ||||||
著者 ローマ字 | ||||||
E.. ROHART | ||||||
著者 所属 | ||||||
ローディア エレクトロニクス カタリシス | ||||||
著者 所属 | ||||||
埼玉大学教育学部 | ||||||
著者 所属 | ||||||
埼玉大学教育学部 | ||||||
著者 所属 | ||||||
ローディア エレクトロニクス カタリシス | ||||||
著者 所属(別言語) | ||||||
Rhodia Electronics & Catalysis | ||||||
著者 所属(別言語) | ||||||
Faculty of Education, Saitama University | ||||||
著者 所属(別言語) | ||||||
Faculty of Education , Saitama University | ||||||
著者 所属(別言語) | ||||||
Rhodia Electronics & Catalysis | ||||||
書誌情報 |
埼玉大学地域共同研究センター紀要 en : Report of Cooperative Research Center, Saitama University 巻 2, p. 18-22, 発行日 2002 |
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年月次 | ||||||
2001 | ||||||
出版者名 | ||||||
出版者 | 埼玉大学地域共同研究センター | |||||
ISSN | ||||||
収録物識別子タイプ | ISSN | |||||
収録物識別子 | 13474758 | |||||
概要 | ||||||
内容記述タイプ | Other | |||||
内容記述 | Ceria(CeO2) slurry has a strong merit in CMF polishing to give a high removal rate. However, it has an unfavorable reputation of problems linked to its quick sedimentation, agglomeration of particles, purity, difficult cleaning, and high cost. In the present study, focusing on the particular issue of the slurry dispersibility, we examined the effect ofultra-sonic (US) treatment ofslurry on its stability and its CMF polishing characteristics in order to make ceria slurry stably applicable to the planarizationCMF. As a result, the US treatment has proved remarkably effective in the elimination of agglomerates, improvement of slurry stability, increase of removal rate and better roughness, offering a breakthrough for the realization ofhigh performance ceria slurry for CMP planarization Comparing to silica slurry, we thus obtained ceria slurry that produces same polished roughness but six times higher removal rate when polished at the pressure of 500g/cm^2. | |||||
資源タイプ | ||||||
内容記述タイプ | Other | |||||
内容記述 | text | |||||
フォーマット | ||||||
内容記述タイプ | Other | |||||
内容記述 | application/pdf | |||||
作成日 | ||||||
日付 | 2009-06-18 | |||||
日付タイプ | Created | |||||
アイテムID | ||||||
KY-AA11808968-02-06 |