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CMP用スラリーにおける界面活性剤の加工特性に及ぼす挙動
https://doi.org/10.24561/00016608
https://doi.org/10.24561/00016608110f37ab-ec6a-4f3d-a122-ded4eabbd77c
名前 / ファイル | ライセンス | アクション |
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KY-AA11808968-02-07.pdf (223.0 kB)
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Item type | 紀要論文 / Departmental Bulletin Paper(1) | |||||
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公開日 | 2009-06-02 | |||||
タイトル | ||||||
タイトル | CMP用スラリーにおける界面活性剤の加工特性に及ぼす挙動 | |||||
言語 | ||||||
言語 | jpn | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | CMP | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Slurry | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Surfactant | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Anion | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Cation | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Nonion | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
資源タイプ | departmental bulletin paper | |||||
ID登録 | ||||||
ID登録 | 10.24561/00016608 | |||||
ID登録タイプ | JaLC | |||||
タイトル(別言語) | ||||||
その他のタイトル | Influence of Surfactants on Polishing Performances of CMP Slurry | |||||
著者 |
浜元, 伸二
× 浜元, 伸二× 土肥, 俊郎× 横山, 健三 |
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著者 ローマ字 | ||||||
Shinji Hamamoto | ||||||
著者 ローマ字 | ||||||
Toshiroh Doy | ||||||
著者 ローマ字 | ||||||
Kenzo Yokoyama | ||||||
著者 所属 | ||||||
ユシロ化学工業株式会社 | ||||||
著者 所属 | ||||||
埼玉大学教育学部機械技術研究室 | ||||||
著者 所属 | ||||||
ユシロ化学工業株式会社 | ||||||
著者 所属(別言語) | ||||||
Yushiro Chemical Industry Co., Ltd. | ||||||
著者 所属(別言語) | ||||||
Mechanical Engineering Lab., Faculty of Education, Saitama University | ||||||
著者 所属(別言語) | ||||||
Yushiro Chemical Industry Co., Ltd. | ||||||
書誌情報 |
埼玉大学地域共同研究センター紀要 en : Report of Cooperative Research Center, Saitama University 巻 2, p. 23-26, 発行日 2002 |
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年月次 | ||||||
2001 | ||||||
出版者名 | ||||||
出版者 | 埼玉大学地域共同研究センター | |||||
ISSN | ||||||
収録物識別子タイプ | ISSN | |||||
収録物識別子 | 13474758 | |||||
概要 | ||||||
内容記述タイプ | Other | |||||
内容記述 | The influence of three different ion type surfactants on fumed silica slurry was studied. The increase of removal rate was observed when the small amount of longer alkyl chain anionic surfactant was added to the slurry. The addition of cationic surfactant caused the significant decrease of removal rate. The addition of nonionic surfactant showed the moderate decrease of removal rate. These differences of polishing performances are considered to be caused by the interaction between surfactants and abrasives/SiO2 film formed over silicon wafer. | |||||
資源タイプ | ||||||
内容記述タイプ | Other | |||||
内容記述 | text | |||||
フォーマット | ||||||
内容記述タイプ | Other | |||||
内容記述 | application/pdf | |||||
作成日 | ||||||
日付 | 2009-06-18 | |||||
日付タイプ | Created | |||||
アイテムID | ||||||
KY-AA11808968-02-07 |