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アイテム
{"_buckets": {"deposit": "ad623044-f14f-4368-9de1-08bb78367ec9"}, "_deposit": {"created_by": 3, "id": "16648", "owners": [3], "pid": {"revision_id": 0, "type": "depid", "value": "16648"}, "status": "published"}, "_oai": {"id": "oai:sucra.repo.nii.ac.jp:00016648", "sets": ["635"]}, "author_link": ["27146", "27144", "27145", "27143"], "item_120_alternative_title_1": {"attribute_name": "タイトル(別言語)", "attribute_value_mlt": [{"subitem_alternative_title": "Study of a Semi-dry polishing method for oxide wafer CMP with Spiral type Fixed Ceria Abrasive Polishing Pad"}]}, "item_120_biblio_info_8": {"attribute_name": "書誌情報", "attribute_value_mlt": [{"bibliographicIssueDates": {"bibliographicIssueDate": "2003", "bibliographicIssueDateType": "Issued"}, "bibliographicPageEnd": "20", "bibliographicPageStart": "14", "bibliographicVolumeNumber": "3", "bibliographic_titles": [{"bibliographic_title": "埼玉大学地域共同研究センター紀要"}, {"bibliographic_title": "Report of Cooperative Research Center, Saitama University", "bibliographic_titleLang": "en"}]}]}, "item_120_date_31": {"attribute_name": "作成日", "attribute_value_mlt": [{"subitem_date_issued_datetime": "2009-06-18", "subitem_date_issued_type": "Created"}]}, "item_120_description_19": {"attribute_name": "概要", "attribute_value_mlt": [{"subitem_description": "Semi-dry polishing method for silicon oxide wafer CMP with Spiral type Fixed Ceria Abrasive polishing pad is proposed in this paper. High MRR of 400nm/min and high WIWNU of 8% are obtained by this method.\nSemi-dry pol ishing method is one of the method of slurry free CMP and is the new method using small amount of pure water instead of slurry and chemical liquid. Key technique of this method is how to control the amount of pure water on the pad surface before pol ishing. Control technique is examined, and polishing mechanism is discussed.", "subitem_description_type": "Other"}]}, "item_120_description_29": {"attribute_name": "資源タイプ", "attribute_value_mlt": [{"subitem_description": "text", "subitem_description_type": "Other"}]}, "item_120_description_30": {"attribute_name": "フォーマット", "attribute_value_mlt": [{"subitem_description": "application/pdf", "subitem_description_type": "Other"}]}, "item_120_identifier_registration": {"attribute_name": "ID登録", "attribute_value_mlt": [{"subitem_identifier_reg_text": "10.24561/00016642", "subitem_identifier_reg_type": "JaLC"}]}, "item_120_publisher_11": {"attribute_name": "出版者名", "attribute_value_mlt": [{"subitem_publisher": "埼玉大学地域共同研究センター"}]}, "item_120_source_id_14": {"attribute_name": "ISSN", "attribute_value_mlt": [{"subitem_source_identifier": "13474758", "subitem_source_identifier_type": "ISSN"}]}, "item_120_text_3": {"attribute_name": "著者 ローマ字", "attribute_value_mlt": [{"subitem_text_value": "Shirota, Wataru"}, {"subitem_text_value": "Sakakibara, Susumu"}, {"subitem_text_value": "Tominaga, Shigeru"}, {"subitem_text_value": "Toshiroh Karari Doy"}]}, "item_120_text_32": {"attribute_name": "アイテムID", "attribute_value_mlt": [{"subitem_text_value": "KY-AA11808968-03-04"}]}, "item_120_text_35": {"attribute_name": "公開日(XooNIps)", "attribute_value_mlt": [{"subitem_text_value": "May 21, 2009 09:00:00"}]}, "item_120_text_36": {"attribute_name": "記録日(XooNIps)", "attribute_value_mlt": [{"subitem_text_value": "2009-06-18"}]}, "item_120_text_37": {"attribute_name": "最終更新日(XooNIps)", "attribute_value_mlt": [{"subitem_text_value": "Jun 18, 2009 13:07:00"}]}, "item_120_text_38": {"attribute_name": "公開日(XooNIps)", "attribute_value_mlt": [{"subitem_text_value": "May 21, 2009 09:00:00"}]}, "item_120_text_39": {"attribute_name": "更新履歴(XooNIps)", "attribute_value_mlt": [{"subitem_text_value": "Jun 18, 2009 所有者を murata から sucra_jim4 に変更"}, {"subitem_text_value": "Jun 18, 2009 作成日, 記録日 を変更"}, {"subitem_text_value": "Jun 4, 2009 所有者を sucra_jim4 から murata に変更"}, {"subitem_text_value": "May 21, 2009 フリーキーワード, インデックス, 抄録 を変更"}]}, "item_120_text_4": {"attribute_name": "著者 所属", "attribute_value_mlt": [{"subitem_text_value": "株式会社ロキテクノ"}, {"subitem_text_value": "株式会社ロキテクノ"}, {"subitem_text_value": "株式会社ロキテクノ"}, {"subitem_text_value": "埼玉大学教育学部"}]}, "item_120_text_40": {"attribute_name": "登録者(XooNIps)", "attribute_value_mlt": [{"subitem_text_value": "sucra_jim4"}]}, "item_120_text_41": {"attribute_name": "閲覧数(XooNIps)", "attribute_value_mlt": [{"subitem_text_value": "1032"}]}, "item_120_text_42": {"attribute_name": "ダウンロード数(XooNIps)", "attribute_value_mlt": [{"subitem_text_value": "1571"}]}, "item_120_text_43": {"attribute_name": "XooNIps_インデックス", "attribute_value_mlt": [{"subitem_text_value": "Public/ジャンル別/研究紀要/埼玉大学/地域共同研究センター紀要|Public/埼玉大学/教育学部|Public/主題別/工学/機械工学/生産工学・加工学|sucra_jim4/埼玉大学/murata"}]}, "item_120_text_44": {"attribute_name": "XooNIps_ITEM_KEY", "attribute_value_mlt": [{"subitem_text_value": "4090"}]}, "item_120_text_5": {"attribute_name": "著者 所属(別言語)", "attribute_value_mlt": [{"subitem_text_value": "ROKITECHNO CO.,LTD"}, {"subitem_text_value": "ROKITECHNO CO.,LTD"}, {"subitem_text_value": "ROKITECHNO CO.,LTD"}, {"subitem_text_value": "Faculty of Education, Saitama University"}]}, "item_120_text_9": {"attribute_name": "年月次", "attribute_value_mlt": [{"subitem_text_value": "2002"}]}, "item_creator": {"attribute_name": "著者", "attribute_type": "creator", "attribute_value_mlt": [{"creatorNames": [{"creatorName": "代田, 渉"}], "nameIdentifiers": [{"nameIdentifier": "27143", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "榊原, 晋"}], "nameIdentifiers": [{"nameIdentifier": "27144", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "富永, 茂"}], "nameIdentifiers": [{"nameIdentifier": "27145", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "土肥, 俊郎"}], "nameIdentifiers": [{"nameIdentifier": "27146", "nameIdentifierScheme": "WEKO"}]}]}, "item_files": {"attribute_name": "ファイル情報", "attribute_type": "file", "attribute_value_mlt": [{"accessrole": "open_date", "date": [{"dateType": "Available", "dateValue": "2018-01-24"}], "displaytype": "detail", "download_preview_message": "", "file_order": 0, "filename": "KY-AA11808968-03-04.pdf", "filesize": [{"value": "468.7 kB"}], "format": "application/pdf", "future_date_message": "", "is_thumbnail": false, "licensetype": "license_free", "mimetype": "application/pdf", "size": 468700.0, "url": {"label": "KY-AA11808968-03-04.pdf", "url": "https://sucra.repo.nii.ac.jp/record/16648/files/KY-AA11808968-03-04.pdf"}, "version_id": "a331eca0-11a9-466c-b441-8009f7af60ad"}]}, "item_language": {"attribute_name": "言語", "attribute_value_mlt": [{"subitem_language": "jpn"}]}, "item_resource_type": {"attribute_name": "資源タイプ", "attribute_value_mlt": [{"resourcetype": "departmental bulletin paper", "resourceuri": "http://purl.org/coar/resource_type/c_6501"}]}, "item_title": "新しい固定砥粒パッドによるのセミドライ加工方法の研究", "item_titles": {"attribute_name": "タイトル", "attribute_value_mlt": [{"subitem_title": "新しい固定砥粒パッドによるのセミドライ加工方法の研究"}]}, "item_type_id": "120", "owner": "3", "path": ["635"], "permalink_uri": "https://doi.org/10.24561/00016642", "pubdate": {"attribute_name": "公開日", "attribute_value": "2009-05-21"}, "publish_date": "2009-05-21", "publish_status": "0", "recid": "16648", "relation": {}, "relation_version_is_last": true, "title": ["新しい固定砥粒パッドによるのセミドライ加工方法の研究"], "weko_shared_id": -1}
新しい固定砥粒パッドによるのセミドライ加工方法の研究
https://doi.org/10.24561/00016642
https://doi.org/10.24561/000166422bbab5c3-30c1-42cb-b117-a7dd868678d0
名前 / ファイル | ライセンス | アクション |
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KY-AA11808968-03-04.pdf (468.7 kB)
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Item type | 紀要論文 / Departmental Bulletin Paper(1) | |||||
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公開日 | 2009-05-21 | |||||
タイトル | ||||||
タイトル | 新しい固定砥粒パッドによるのセミドライ加工方法の研究 | |||||
言語 | ||||||
言語 | jpn | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
資源タイプ | departmental bulletin paper | |||||
ID登録 | ||||||
ID登録 | 10.24561/00016642 | |||||
ID登録タイプ | JaLC | |||||
タイトル(別言語) | ||||||
その他のタイトル | Study of a Semi-dry polishing method for oxide wafer CMP with Spiral type Fixed Ceria Abrasive Polishing Pad | |||||
著者 |
代田, 渉
× 代田, 渉× 榊原, 晋× 富永, 茂× 土肥, 俊郎 |
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著者 ローマ字 | ||||||
Shirota, Wataru | ||||||
著者 ローマ字 | ||||||
Sakakibara, Susumu | ||||||
著者 ローマ字 | ||||||
Tominaga, Shigeru | ||||||
著者 ローマ字 | ||||||
Toshiroh Karari Doy | ||||||
著者 所属 | ||||||
株式会社ロキテクノ | ||||||
著者 所属 | ||||||
株式会社ロキテクノ | ||||||
著者 所属 | ||||||
株式会社ロキテクノ | ||||||
著者 所属 | ||||||
埼玉大学教育学部 | ||||||
著者 所属(別言語) | ||||||
ROKITECHNO CO.,LTD | ||||||
著者 所属(別言語) | ||||||
ROKITECHNO CO.,LTD | ||||||
著者 所属(別言語) | ||||||
ROKITECHNO CO.,LTD | ||||||
著者 所属(別言語) | ||||||
Faculty of Education, Saitama University | ||||||
書誌情報 |
埼玉大学地域共同研究センター紀要 en : Report of Cooperative Research Center, Saitama University 巻 3, p. 14-20, 発行日 2003 |
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年月次 | ||||||
2002 | ||||||
出版者名 | ||||||
出版者 | 埼玉大学地域共同研究センター | |||||
ISSN | ||||||
収録物識別子タイプ | ISSN | |||||
収録物識別子 | 13474758 | |||||
概要 | ||||||
内容記述タイプ | Other | |||||
内容記述 | Semi-dry polishing method for silicon oxide wafer CMP with Spiral type Fixed Ceria Abrasive polishing pad is proposed in this paper. High MRR of 400nm/min and high WIWNU of 8% are obtained by this method. Semi-dry pol ishing method is one of the method of slurry free CMP and is the new method using small amount of pure water instead of slurry and chemical liquid. Key technique of this method is how to control the amount of pure water on the pad surface before pol ishing. Control technique is examined, and polishing mechanism is discussed. |
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資源タイプ | ||||||
内容記述タイプ | Other | |||||
内容記述 | text | |||||
フォーマット | ||||||
内容記述タイプ | Other | |||||
内容記述 | application/pdf | |||||
作成日 | ||||||
日付 | 2009-06-18 | |||||
日付タイプ | Created | |||||
アイテムID | ||||||
KY-AA11808968-03-04 |